MPC8270VRMIB datasheet, PDF - EEWORLD Datasheet

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MPC8270VRMIB: DescriptionIC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,BGA,516PIN; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，80 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MPC8270VRMIB Overview

IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,BGA,516PIN

MPC8270VRMIB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
package instruction	BGA, BGA516,26X26,40
Reach Compliance Code	unknown
JESD-30 code	S-PBGA-B516
JESD-609 code	e1
Humidity sensitivity level	3
Number of terminals	516
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA516,26X26,40
Package shape	SQUARE
Package form	GRID ARRAY
power supply	1.5,3.3 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM

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Freescale Semiconductor

Technical Data

MPC8280EC

Rev. 1.4, 11/2005

MPC8280

PowerQUICC II™ Family

Hardware Specifications

This document contains detailed information about power

considerations, DC/AC electrical characteristics, and AC timing

specifications for .13µm (HiP7) members of the

PowerQUICC II™ family of integrated communications

processors—the MPC8280, the MPC8275, and the MPC8270

(collectively called 'the MPC8280' throughout this document).

Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . 7

DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . 8

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 11

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

AC Electrical Characteristics . . . . . . . . . . . . . . . . . . 14

Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 23

Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 72

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 74

Document Revision History . . . . . . . . . . . . . . . . . . . 75

10.

11.

Overview

•

— 60x-PCI bus core logic that uses a buffer pool to allocate buffers for each port

— Uses the local bus signals, removing need for additional pins

System interface unit (SIU)

— Clock synthesizer

— Reset controller

— Real-time clock (RTC) register

— Periodic interrupt timer

— Hardware bus monitor and software watchdog timer

— IEEE 1149.1 JTAG test access port

12-bank memory controller

— Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other user- definable

peripherals

— Byte write enables and selectable parity generation

— 32-bit address decodes with programmable bank size

— Three user-programmable machines, general-purpose chip-select machine, and page-mode pipeline

SDRAM machine

— Byte selects for 64-bus width (60x) and byte selects for 32-bus width (local)

— Dedicated interface logic for SDRAM

CPU core can be disabled and the device can be used in slave mode to an external core

Communications processor module (CPM)

— Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support for

communications protocols

— Interfaces to G2_LE core through an on-chip 32-Kbyte dual-port data RAM, an on-chip 32-Kbyte

dual-port instruction RAM and DMA controller

— Serial DMA channels for receive and transmit on all serial channels

— Parallel I/O registers with open-drain and interrupt capability

— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers

— Three fast communications controllers supporting the following protocols:

– 10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent interface (MII)

or reduced media independent interface (RMII)

– ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5, AAL1, AAL0

protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 64 K external connections (no ATM

support for the MPC8270)

– Transparent

– HDLC—Up to T3 rates (clear channel)

– FCC2 can also be connected to the TC layer (MPC8280 only)

— Two multichannel controllers (MCCs) (one MCC on the MPC8270)

– Each MCC handles 128 serial, full-duplex, 64-Kbps data channels. Each MCC can be split into four

subgroups of 32 channels each.

– Almost any combination of subgroups can be multiplexed to single or multiple TDM interfaces up

to four TDM interfaces per MCC

MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.4

Freescale Semiconductor

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