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SN74AUP2G08DCUR

Description
AND Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R
File Size1MB,25 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

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SN74AUP2G08DCUR Overview

AND Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R

SN74AUP2G08DCUR Parametric

Parameter NameAttribute value
EU restricts the use of certain hazardous substancesCompliant
ECCN (US)EAR99
Part StatusActive
HTS8542.39.00.01
Logic FamilyAUP
Logic FunctionAND
Number of Elements per Chip2
Number of Element Inputs2-IN
Number of Output Enables per Element0
Number of Selection Inputs per Element0
Number of Element Outputs1
Maximum Propagation Delay Time @ Maximum CL (ns)26.3@1.2V|16.6@1.5V|12.9@1.8V|8.8@2.5V|6.7@3.3V
Absolute Propagation Delay Time (ns)27
Process TechnologyCMOS
Output TypePush-Pull
Maximum Low Level Output Current (mA)4
Maximum High Level Output Current (mA)-4
Minimum Operating Supply Voltage (V)0.8
Typical Operating Supply Voltage (V)2.5|3.3|1.8
Maximum Operating Supply Voltage (V)3.6
Maximum Quiescent Current (uA)0.5
Propagation Delay Test Condition (pF)30
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
Supplier Temperature GradeCommercial
PackagingTape and Reel
Standard Package NameSOP
Pin Count8
Supplier PackageVSSOP
MountingSurface Mount
Package Height0.8(Max)
Package Length2.1(Max)
Package Width2.4(Max)
PCB changed8
Lead ShapeGull-wing

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Description AND Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R Low-Power Dual 2-Input Positive-AND Gate 8-DSBGA -40 to 85 Low-Power Dual 2-Input Positive-AND Gate 8-DSBGA -40 to 85 Low-Power Dual 2-Input Positive-AND Gate 8-UQFN -40 to 85 Low-Power Dual 2-Input Positive-AND Gate 8-X2SON -40 to 85
Brand Name - Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? - Lead free Lead free Lead free Lead free
Is it Rohs certified? - conform to conform to conform to conform to
Maker - Texas Instruments Texas Instruments Texas Instruments -
Parts packaging code - BGA BGA QFN QFN
package instruction - VFBGA, BGA8,2X4,20 VFBGA, BGA8,2X4,16 HVQCCN, LCC8,.06SQ,20 VSSOP, SOLCC8,.04,14
Contacts - 8 8 8 8
Reach Compliance Code - compli compli compli compli
ECCN code - EAR99 EAR99 EAR99 EAR99
Factory Lead Time - 1 week 1 week 1 week 6 weeks
series - AUP/ULP/V AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code - R-XBGA-B8 R-XBGA-B8 S-XQCC-N8 R-PDSO-G8
JESD-609 code - e1 e1 e4 e4
length - 1.9 mm 1.57 mm 1.5 mm 1.4 mm
Load capacitance (CL) - 30 pF 30 pF 30 pF 30 pF
Logic integrated circuit type - AND GATE AND GATE AND GATE AND GATE
MaximumI(ol) - 0.004 A 0.004 A 0.004 A 0.004 A
Humidity sensitivity level - 1 1 1 1
Number of functions - 2 2 2 2
Number of entries - 2 2 2 2
Number of terminals - 8 8 8 8
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Output characteristics - 3-STATE 3-STATE 3-STATE -
Package body material - UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
encapsulated code - VFBGA VFBGA HVQCCN VSSOP
Encapsulate equivalent code - BGA8,2X4,20 BGA8,2X4,16 LCC8,.06SQ,20 SOLCC8,.04,14
Package shape - RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
method of packing - TR TR TR TR
Peak Reflow Temperature (Celsius) - 260 260 260 260
power supply - 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Maximum supply current (ICC) - 0.0009 mA 0.0009 mA 0.0009 mA 0.0009 mA
Prop。Delay @ Nom-Su - 27 ns 27 ns 27 ns 27 ns
propagation delay (tpd) - 27 ns 27 ns 27 ns 27 ns
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger - NO NO NO NO
Maximum seat height - 0.5 mm 0.5 mm 0.6 mm 0.4 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) - 3 V 3 V 3 V 1.1 V
surface mount - YES YES YES YES
technology - CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal form - BALL BALL NO LEAD GULL WING
Terminal pitch - 0.5 mm 0.4 mm 0.5 mm 0.35 mm
Terminal location - BOTTOM BOTTOM QUAD DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 0.9 mm 0.77 mm 1.5 mm 1 mm
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