SN74AUP2G240YFPR datasheet, PDF

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SN74AUP2G240YFPR: DescriptionLow-Power Dual Buffer/Driver With 3-State Outputs 8-DSBGA -40 to 85; Categorylogic logic; File Size1MB，21 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74AUP2G240YFPR Overview

Low-Power Dual Buffer/Driver With 3-State Outputs 8-DSBGA -40 to 85

SN74AUP2G240YFPR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	VFBGA, BGA8,2X4,16
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	6 weeks
Control type	ENABLE LOW
Counting direction	UNIDIRECTIONAL
series	AUP/ULP/V
JESD-30 code	R-XBGA-B8
JESD-609 code	e1
length	1.57 mm
Load capacitance (CL)	30 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of digits	1
Number of functions	2
Number of ports	2
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	INVERTED
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA8,2X4,16
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	1.2/3.3 V
Maximum supply current (ICC)	0.0009 mA
Prop。Delay @ Nom-Su	25.5 ns
propagation delay (tpd)	25.5 ns
Certification status	Not Qualified
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.4 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
translate	N/A
width	0.77 mm
Base Number Matches	1

SN74AUP2G240YFPR Related Products

	SN74AUP2G240YFPR	SN74AUP2G240DCUR	SN74AUP2G240RSER	SN74AUP2G240DQER
Description	Low-Power Dual Buffer/Driver With 3-State Outputs 8-DSBGA -40 to 85	Low-Power Dual Buffer/Driver With 3-State Outputs 8-VSSOP -40 to 85	Low-Power Dual Buffer/Driver With 3-State Outputs 8-UQFN -40 to 85	Low-Power Dual Buffer/Driver With 3-State Outputs 8-X2SON -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	BGA	SOIC	QFN	QFN
package instruction	VFBGA, BGA8,2X4,16	VSSOP, TSSOP8,.12,20	QFN-8	HSON, SOLCC8,.04,14
Contacts	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99
Factory Lead Time	6 weeks	1 week	6 weeks	6 weeks
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
Counting direction	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL
series	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V
JESD-30 code	R-XBGA-B8	R-PDSO-G8	S-XQCC-N8	R-PDSO-N8
JESD-609 code	e1	e4	e4	e4
length	1.57 mm	2.3 mm	1.5 mm	1.4 mm
Load capacitance (CL)	30 pF	30 pF	30 pF	30 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A
Humidity sensitivity level	1	1	1	1
Number of digits	1	1	1	1
Number of functions	2	2	2	2
Number of ports	2	2	2	2
Number of terminals	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	INVERTED	INVERTED	INVERTED	INVERTED
Package body material	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	VFBGA	VSSOP	VQCCN	HSON
Encapsulate equivalent code	BGA8,2X4,16	TSSOP8,.12,20	LCC8,.06SQ,20	SOLCC8,.04,14
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG
method of packing	TR	TR	TR	TR
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V
Maximum supply current (ICC)	0.0009 mA	0.0009 mA	0.0009 mA	0.0009 mA
Prop。Delay @ Nom-Su	25.5 ns	25.5 ns	19.9 ns	25.5 ns
propagation delay (tpd)	25.5 ns	25.5 ns	25.5 ns	25.5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.5 mm	0.9 mm	0.6 mm	0.4 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	0.8 V	0.8 V	0.8 V	0.8 V
Nominal supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal form	BALL	GULL WING	NO LEAD	NO LEAD
Terminal pitch	0.4 mm	0.5 mm	0.5 mm	0.35 mm
Terminal location	BOTTOM	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
translate	N/A	N/A	N/A	N/A
width	0.77 mm	2 mm	1.5 mm	1 mm

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