|
SN74AUP2G240DQER |
SN74AUP2G240YFPR |
SN74AUP2G240DCUR |
SN74AUP2G240RSER |
| Description |
Low-Power Dual Buffer/Driver With 3-State Outputs 8-X2SON -40 to 85 |
Low-Power Dual Buffer/Driver With 3-State Outputs 8-DSBGA -40 to 85 |
Low-Power Dual Buffer/Driver With 3-State Outputs 8-VSSOP -40 to 85 |
Low-Power Dual Buffer/Driver With 3-State Outputs 8-UQFN -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Parts packaging code |
QFN |
BGA |
SOIC |
QFN |
| package instruction |
HSON, SOLCC8,.04,14 |
VFBGA, BGA8,2X4,16 |
VSSOP, TSSOP8,.12,20 |
QFN-8 |
| Contacts |
8 |
8 |
8 |
8 |
| Reach Compliance Code |
compli |
compli |
compli |
compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Factory Lead Time |
6 weeks |
6 weeks |
1 week |
6 weeks |
| Control type |
ENABLE LOW |
ENABLE LOW |
ENABLE LOW |
ENABLE LOW |
| Counting direction |
UNIDIRECTIONAL |
UNIDIRECTIONAL |
UNIDIRECTIONAL |
UNIDIRECTIONAL |
| series |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
AUP/ULP/V |
| JESD-30 code |
R-PDSO-N8 |
R-XBGA-B8 |
R-PDSO-G8 |
S-XQCC-N8 |
| JESD-609 code |
e4 |
e1 |
e4 |
e4 |
| length |
1.4 mm |
1.57 mm |
2.3 mm |
1.5 mm |
| Load capacitance (CL) |
30 pF |
30 pF |
30 pF |
30 pF |
| Logic integrated circuit type |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
| MaximumI(ol) |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
| Number of digits |
1 |
1 |
1 |
1 |
| Number of functions |
2 |
2 |
2 |
2 |
| Number of ports |
2 |
2 |
2 |
2 |
| Number of terminals |
8 |
8 |
8 |
8 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Output polarity |
INVERTED |
INVERTED |
INVERTED |
INVERTED |
| Package body material |
PLASTIC/EPOXY |
UNSPECIFIED |
PLASTIC/EPOXY |
UNSPECIFIED |
| encapsulated code |
HSON |
VFBGA |
VSSOP |
VQCCN |
| Encapsulate equivalent code |
SOLCC8,.04,14 |
BGA8,2X4,16 |
TSSOP8,.12,20 |
LCC8,.06SQ,20 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
| Package form |
SMALL OUTLINE, HEAT SINK/SLUG |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, VERY THIN PROFILE |
| method of packing |
TR |
TR |
TR |
TR |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| power supply |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
1.2/3.3 V |
| Maximum supply current (ICC) |
0.0009 mA |
0.0009 mA |
0.0009 mA |
0.0009 mA |
| Prop。Delay @ Nom-Su |
25.5 ns |
25.5 ns |
25.5 ns |
19.9 ns |
| propagation delay (tpd) |
25.5 ns |
25.5 ns |
25.5 ns |
25.5 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
0.4 mm |
0.5 mm |
0.9 mm |
0.6 mm |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
| Minimum supply voltage (Vsup) |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
| Nominal supply voltage (Vsup) |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| Terminal form |
NO LEAD |
BALL |
GULL WING |
NO LEAD |
| Terminal pitch |
0.35 mm |
0.4 mm |
0.5 mm |
0.5 mm |
| Terminal location |
DUAL |
BOTTOM |
DUAL |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| translate |
N/A |
N/A |
N/A |
N/A |
| width |
1 mm |
0.77 mm |
2 mm |
1.5 mm |
京公网安备 11010802033920号
EEWORLD
