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HSMP-3832-BLKG

Description
Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3
CategoryDiscrete semiconductor    diode   
File Size238KB,7 Pages
ManufacturerBroadcom
Environmental Compliance
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HSMP-3832-BLKG Overview

Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3

HSMP-3832-BLKG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerBroadcom
package instructionR-PDSO-G3
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresLOW DISTORTION
applicationATTENUATOR; SWITCHING
Minimum breakdown voltage200 V
ConfigurationSERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Maximum diode capacitance0.3 pF
Nominal diode capacitance0.3 pF
Diode component materialsSILICON
Maximum diode forward resistance1.5 Ω
Diode resistance test current100 mA
Diode resistance test frequency100 MHz
Diode typePIN DIODE
JESD-30 codeR-PDSO-G3
JESD-609 codee4
Minority carrier nominal lifetime0.5 µs
Humidity sensitivity level1
Number of components2
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Maximum power dissipation0.25 W
Certification statusNot Qualified
Reverse test voltage50 V
surface mountYES
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
HSMP-383x
Surface Mount RF PIN Diodes
Data Sheet
Description/Applications
The HSMP-383x series of general purpose PIN diodes
are designed for two classes of applications. The first
is attenuators where current consumption is the most
important design consideration. The second application
for this series of diodes is in switches where low
capacitance is the driving issue for the designer.
The HSMP-386x series Total Capacitance (C
T
) and Total
Resistance (R
T
) are typical specifications. For applications
that require guaranteed performance, the general
purpose HSMP-383x series is recommended.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic,
carrier lifetime.
Features
Diodes Optimized for:
Low Capacitance Switching
Low Current Attenuator
Surface Mount SOT-23 Package
Single and Dual Versions
Tape and Reel Options Available
Low Failure in Time (FIT) Rate
[1]
Lead-free
Note:
1. For more information see the Surface Mount PIN Reliability Data Sheet.
Package Lead Code Identification (Top View)
SINGLE
SERIES
#0
COMMON
ANODE
#2
COMMON
CATHODE
#3
#4

HSMP-3832-BLKG Related Products

HSMP-3832-BLKG HSMP-3830-BLKG HSMP-3830-TR1 HSMP-3832-TR1G HSMP-3832-TR2G HSMP-3833-TR1G HSMP-3833-BLKG HSMP-3833-TR2G HSMP-3832-TR1
Description Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 Pin Diode, 200V V(BR), Silicon, SOT-23, 3 PIN Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 Pin Diode, 200V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 Pin Diode, 200V V(BR), Silicon, SOT-23, 3 PIN
Is it Rohs certified? conform to conform to incompatible conform to conform to conform to conform to conform to incompatible
package instruction R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 SOT-23, 3 PIN
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant unknown
Other features LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION LOW DISTORTION
application ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING ATTENUATOR; SWITCHING
Minimum breakdown voltage 200 V 200 V 200 V 200 V 200 V 200 V 200 V 200 V 200 V
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS SINGLE SINGLE SERIES CONNECTED, CENTER TAP, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Maximum diode capacitance 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF
Nominal diode capacitance 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF 0.3 pF
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Maximum diode forward resistance 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω 1.5 Ω
Diode resistance test current 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA
Diode resistance test frequency 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
Diode type PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE
JESD-30 code R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
JESD-609 code e4 e4 e0 e4 e4 e4 e4 e4 e0
Minority carrier nominal lifetime 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs 0.5 µs
Number of components 2 1 1 2 2 2 2 2 2
Number of terminals 3 3 3 3 3 3 3 3 3
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 NOT SPECIFIED 260 260 260 260 260 NOT SPECIFIED
Maximum power dissipation 0.25 W 0.25 W 0.25 W 0.25 W 0.25 W 0.25 W 0.25 W 0.25 W 0.25 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Reverse test voltage 50 V 50 V 50 V 50 V 50 V 50 V 50 V 50 V 50 V
surface mount YES YES YES YES YES YES YES YES YES
technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maker Broadcom Broadcom - Broadcom Broadcom Broadcom Broadcom Broadcom Broadcom
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 - EAR99
Humidity sensitivity level 1 1 - 1 1 1 1 1 -
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