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HCS412T-/SN

Description
TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8
CategoryWireless rf/communication    Telecom circuit   
File Size977KB,52 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Parametric Compare View All

HCS412T-/SN Overview

TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8

HCS412T-/SN Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeSOIC
package instructionSOP,
Contacts8
Reach Compliance Codecompliant
JESD-30 codeR-PDSO-G8
JESD-609 codee3
Humidity sensitivity level1
Number of functions1
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Nominal supply voltage3 V
surface mountYES
Telecom integrated circuit typesDATA ENCRYPTION CIRCUIT
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature40
HCS412
K
EE
L
OQ®
Code Hopping Encoder and Transponder
FEATURES
Security
Programmable 64-bit encoder crypt key
Two 64-bit IFF keys
Keys are read protected
32-bit bi-directional challenge and response using
one of two possible keys
69-bit transmission length
• 32-bit hopping code,
• 37-bit nonencrypted portion
Programmable 28/32-bit serial number
60-bit, read protected seed for secure learning
Two IFF encryption algorithms
Delayed counter increment mechanism
Asynchronous transponder communication
Transmissions include button Queuing
information
2.0V to 6.3V operation
Three switch inputs: S2, S1, S0 – seven functions
Battery-less bi-directional transponder capability
Selectable baud rate and code word blanking
Automatic code word completion
Battery low detector
PWM or Manchester data encoding
Combined transmitter, transponder operation
Anticollision of multiple transponders
Passive proximity activation
Device protected against reverse battery
Intelligent damping for high Q LC-circuits
100 mV
PP
sensitive LC input
Automotive remote entry systems
Automotive alarm systems
Automotive immobilizers
Gate and garage openers
Electronic door locks (Home/Office/Hotel)
Burglar alarm systems
Proximity access control
PACKAGE TYPES
PDIP, SOIC
S0
S1
S2/RFEN/LC1
LC0
1
8
V
DD
LED
DATA
GND
HCS412
2
3
4
7
6
5
BLOCK DIAGRAM
V
DD
Power
Control
Oscillator
Configuration Register
S0
S1
Debounce
Control
and
Queuer
Address EEPROM
Decoding
Wake-up
Logic
Control Logic
and Counters
Operating
LED
Transponder
Circuitry
LC0
RFEN/S2/LC1
PPM
Detector
DATA
PPM
Manch.
Encoder
DATA
DATA
Driver
Other
Simple programming interface
On-chip tunable RC oscillator, ± 10%
On-chip EEPROM
64-bit user EEPROM in Transponder mode
Battery-low LED indication
Serialized Quick Turn Programming (SQTP
SM
)
8-pin PDIP/SOIC
RF Enable output
ASK and FSK PLL interface option
Built in LC input amplifier
Typical Applications
©
2011 Microchip Technology Inc.
DS41099D-page 1
Register
LED
Control
Encryption/Increment
Logic

HCS412T-/SN Related Products

HCS412T-/SN HCS412-I/SN HCS412-I/P HCS412T-I/SN HCS412T/SN HCS412/P HCS412/SN HCS412-/SN HCS412TI/SN HCS412-/P
Description TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 IC code hop encodr/trnspnd 8soic IC code hop encodr/trnspond 8dip IC code hop encodr/trnspnd 8soic IC code hop encodr/trnspnd 8soic IC code hop encodr/trnspond 8dip IC code hop encodr/trnspnd 8soic TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, DIP-8
Is it lead-free? Lead free Lead free Lead free - Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to - conform to conform to conform to conform to conform to conform to
Maker Microchip Microchip Microchip - Microchip Microchip Microchip Microchip Microchip Microchip
Parts packaging code SOIC SOIC DIP - SOIC DIP SOIC SOIC SOIC DIP
package instruction SOP, SOP, SOP8,.25 DIP, DIP8,.3 - SOP, SOP8,.25 DIP, DIP8,.3 SOP, SOP8,.25 SOP, SOP, SOP8,.25 DIP,
Contacts 8 8 8 - 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant - compliant compliant compliant compliant compliant compliant
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 - R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8
JESD-609 code e3 e3 e3 - e3 e3 e3 e3 e3 e3
Humidity sensitivity level 1 1 - - 1 - 1 1 1 -
Number of functions 1 1 1 - 1 1 1 1 1 1
Number of terminals 8 8 8 - 8 8 8 8 8 8
Maximum operating temperature 70 °C 85 °C 85 °C - 70 °C 70 °C 70 °C 70 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP DIP - SOP DIP SOP SOP SOP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE IN-LINE - SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Celsius) 260 260 NOT SPECIFIED - 260 NOT SPECIFIED 260 260 260 NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 3 V 3 V 3 V - 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES NO - YES NO YES YES YES NO
Telecom integrated circuit types DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT - DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface MATTE TIN Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) MATTE TIN Matte Tin (Sn) MATTE TIN
Terminal form GULL WING GULL WING THROUGH-HOLE - GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING THROUGH-HOLE
Terminal location DUAL DUAL DUAL - DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 NOT SPECIFIED - 40 NOT SPECIFIED 40 40 40 NOT SPECIFIED
length - 4.9 mm 9.46 mm - 4.9 mm 9.46 mm 4.9 mm - 4.9 mm -
Encapsulate equivalent code - SOP8,.25 DIP8,.3 - SOP8,.25 DIP8,.3 SOP8,.25 - SOP8,.25 -
power supply - 2/6.3 V 2/6.5 V - 2/6.3 V 2/6.3 V 2/6.3 V - 2/6.3 V -
Maximum seat height - 1.75 mm 4.32 mm - 1.75 mm 4.32 mm 1.75 mm - 1.75 mm -
Maximum slew rate - 0.0005 mA 0.0003 mA - 0.0003 mA 0.0003 mA 0.0003 mA - 0.0005 mA -
Terminal pitch - 1.27 mm 2.54 mm - 1.27 mm 2.54 mm 1.27 mm - 1.27 mm -
width - 3.9 mm 7.62 mm - 3.9116 mm 7.62 mm 3.9116 mm - 3.9 mm -
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