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HCS412/P

Description
IC code hop encodr/trnspond 8dip
CategoryWireless rf/communication    Telecom circuit   
File Size977KB,52 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Parametric Compare View All

HCS412/P Overview

IC code hop encodr/trnspond 8dip

HCS412/P Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeDIP
package instructionDIP, DIP8,.3
Contacts8
Reach Compliance Codecompliant
JESD-30 codeR-PDIP-T8
JESD-609 codee3
length9.46 mm
Number of functions1
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2/6.3 V
Certification statusNot Qualified
Maximum seat height4.32 mm
Maximum slew rate0.0003 mA
Nominal supply voltage3 V
surface mountNO
Telecom integrated circuit typesDATA ENCRYPTION CIRCUIT
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
HCS412
K
EE
L
OQ®
Code Hopping Encoder and Transponder
FEATURES
Security
Programmable 64-bit encoder crypt key
Two 64-bit IFF keys
Keys are read protected
32-bit bi-directional challenge and response using
one of two possible keys
69-bit transmission length
• 32-bit hopping code,
• 37-bit nonencrypted portion
Programmable 28/32-bit serial number
60-bit, read protected seed for secure learning
Two IFF encryption algorithms
Delayed counter increment mechanism
Asynchronous transponder communication
Transmissions include button Queuing
information
2.0V to 6.3V operation
Three switch inputs: S2, S1, S0 – seven functions
Battery-less bi-directional transponder capability
Selectable baud rate and code word blanking
Automatic code word completion
Battery low detector
PWM or Manchester data encoding
Combined transmitter, transponder operation
Anticollision of multiple transponders
Passive proximity activation
Device protected against reverse battery
Intelligent damping for high Q LC-circuits
100 mV
PP
sensitive LC input
Automotive remote entry systems
Automotive alarm systems
Automotive immobilizers
Gate and garage openers
Electronic door locks (Home/Office/Hotel)
Burglar alarm systems
Proximity access control
PACKAGE TYPES
PDIP, SOIC
S0
S1
S2/RFEN/LC1
LC0
1
8
V
DD
LED
DATA
GND
HCS412
2
3
4
7
6
5
BLOCK DIAGRAM
V
DD
Power
Control
Oscillator
Configuration Register
S0
S1
Debounce
Control
and
Queuer
Address EEPROM
Decoding
Wake-up
Logic
Control Logic
and Counters
Operating
LED
Transponder
Circuitry
LC0
RFEN/S2/LC1
PPM
Detector
DATA
PPM
Manch.
Encoder
DATA
DATA
Driver
Other
Simple programming interface
On-chip tunable RC oscillator, ± 10%
On-chip EEPROM
64-bit user EEPROM in Transponder mode
Battery-low LED indication
Serialized Quick Turn Programming (SQTP
SM
)
8-pin PDIP/SOIC
RF Enable output
ASK and FSK PLL interface option
Built in LC input amplifier
Typical Applications
©
2011 Microchip Technology Inc.
DS41099D-page 1
Register
LED
Control
Encryption/Increment
Logic

HCS412/P Related Products

HCS412/P HCS412-I/SN HCS412-I/P HCS412T-I/SN HCS412T/SN HCS412/SN HCS412-/SN HCS412TI/SN HCS412T-/SN HCS412-/P
Description IC code hop encodr/trnspond 8dip IC code hop encodr/trnspnd 8soic IC code hop encodr/trnspond 8dip IC code hop encodr/trnspnd 8soic IC code hop encodr/trnspnd 8soic IC code hop encodr/trnspnd 8soic TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, DIP-8
Is it lead-free? Lead free Lead free Lead free - Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to - conform to conform to conform to conform to conform to conform to
Maker Microchip Microchip Microchip - Microchip Microchip Microchip Microchip Microchip Microchip
Parts packaging code DIP SOIC DIP - SOIC SOIC SOIC SOIC SOIC DIP
package instruction DIP, DIP8,.3 SOP, SOP8,.25 DIP, DIP8,.3 - SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP, SOP8,.25 SOP, DIP,
Contacts 8 8 8 - 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant - compliant compliant compliant compliant compliant compliant
JESD-30 code R-PDIP-T8 R-PDSO-G8 R-PDIP-T8 - R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8
JESD-609 code e3 e3 e3 - e3 e3 e3 e3 e3 e3
length 9.46 mm 4.9 mm 9.46 mm - 4.9 mm 4.9 mm - 4.9 mm - -
Number of functions 1 1 1 - 1 1 1 1 1 1
Number of terminals 8 8 8 - 8 8 8 8 8 8
Maximum operating temperature 70 °C 85 °C 85 °C - 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP - SOP SOP SOP SOP SOP DIP
Encapsulate equivalent code DIP8,.3 SOP8,.25 DIP8,.3 - SOP8,.25 SOP8,.25 - SOP8,.25 - -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 NOT SPECIFIED - 260 260 260 260 260 NOT SPECIFIED
power supply 2/6.3 V 2/6.3 V 2/6.5 V - 2/6.3 V 2/6.3 V - 2/6.3 V - -
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.32 mm 1.75 mm 4.32 mm - 1.75 mm 1.75 mm - 1.75 mm - -
Maximum slew rate 0.0003 mA 0.0005 mA 0.0003 mA - 0.0003 mA 0.0003 mA - 0.0005 mA - -
Nominal supply voltage 3 V 3 V 3 V - 3 V 3 V 3 V 3 V 3 V 3 V
surface mount NO YES NO - YES YES YES YES YES NO
Telecom integrated circuit types DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT - DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL - COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) MATTE TIN Matte Tin (Sn) MATTE TIN MATTE TIN
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE - GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm - 1.27 mm 1.27 mm - 1.27 mm - -
Terminal location DUAL DUAL DUAL - DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 40 NOT SPECIFIED - 40 40 40 40 40 NOT SPECIFIED
width 7.62 mm 3.9 mm 7.62 mm - 3.9116 mm 3.9116 mm - 3.9 mm - -
Humidity sensitivity level - 1 - - 1 1 1 1 1 -

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