Placement efficiency of Chip Resistor Array is two, four or eight times of the flat type chip resistor
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
B
V
8
V
4
7
2
J
V
Product Code
Thick Film
Chip Resistor
Networks
1
2
3
N
V
S
Chip Resistor Array
Type: inches
0201 Array
0402 Array
Convex Terminal
0603 Array
0402 Array
0603 Array Concave Terminal
0805 Array
No. of Terminal
4 4 Terminal
8 8 Terminal
H 16 Terminal
Schematics
V
Isolated
type
Resistance Value
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following. Jumper is
expressed by R00
Example: 222: 2.2 k
Resistance
Tolerance
J
±5
%
0 Jumper
Packaging Methods
Packaging
Code
Nil
Embossed
Carrier Taping
(S8V)
Punched Carrier Taping
2 mm pitch
(14V, 18V, 24V, 28V, N8V)
Punched Carrier Taping
4 mm pitch
(2HV, 34V, 38V, V4V, V8V)
X
V
■
Construction (Example : Concave Terminal)
■
Schematics
●
Isolated type
14V, 24V, 34V, V4V
2 resistors
4
3
8
18V, 28V, N8V, 38V, V8V, S8V
4 resistors
7
6
5
Protective coating
1
2
1
2
3
4
Alumina substrate
Electrode (Outer)
Electrode (Between)
2HV
8 resistors
16 15 14 13 12 11 10
9
Thick film
resistive element
Electrode (Inner)
1
2
3
4
5
6
7
8
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Array
■
Dimensions in mm (not to scale)
(1) Convex Terminal type
A1
EXB14V, 24V, 34V
B
G
A1
A2
EXB28V, 38V
B
G
T
L
EXB2HV
B
G
G
W
P
B
T
G
W
B
G
W
P
L
A1 A2
T
P
L
Type
(inches)
EXB14V (0201 2)
EXB24V (0402 2)
EXB28V (0402 4)
EXB2HV (0402 8)
EXB34V (0603 2)
EXB38V (0603 4)
Dimensions (mm)
L
0.80
±0.10
1.00
±0.10
2.00
±0.10
3.80
±0.10
1.60
±0.20
3.20
±0.20
W
0.60
±0.10
1.00
±0.10
1.00
±0.10
1.60
±0.10
1.60
±0.15
1.60
±0.15
T
0.35
±0.10
0.35
±0.10
0.35
±0.10
0.45
±0.10
0.50
±0.10
0.50
±0.10
A1
0.35
±0.10
0.40
±0.10
0.45
±0.10
0.35
±0.10
0.65
±0.15
0.65
±0.15
A2
—
—
0.35
±0.10
0.35
±0.10
—
0.45
±0.15
B
0.15
±0.10
0.18
±0.10
0.20
±0.10
0.30
±0.10
0.30
±0.20
0.30
±0.20
P
(0.50)
(0.65)
(0.50)
(0.50)
(0.80)
(0.80)
G
0.15
±0.10
0.25
±0.10
0.25
±0.10
0.30
±0.10
0.30
±0.20
0.35
±0.20
B
Mass (Weight)
[g/1000 pcs.]
0.5
1.2
2.0
9.0
3.5
7.0
( ) Reference
(2) Concave Terminal type
A1
EXBV4V
B
G
A1
A2
EXBN8V, V8V, S8V
B
G
T
G
W
G
B
P
L
T
P
L
Type
(inches)
EXBN8V (0402 4)
EXBV4V (0603 2)
EXBV8V (0603 4)
EXBS8V (0805 4)
Dimensions (mm)
L
2.00
±0.10
1.60
+0.20
–0.10
3.20
+0.20
–0.10
5.08
+0.20
–0.10
B
W
W
1.00
±0.10
1.60
+0.20
–0.10
1.60
+0.20
–0.10
2.20
+0.20
–0.10
T
0.45
±0.10
0.60
±0.10
0.60
±0.10
0.70
±0.20
A1
0.30
±0.10
0.60
±0.10
0.60
±0.10
0.80
±0.15
A2
0.30
±0.10
—
0.60
±0.10
0.80
±0.15
B
0.20
±0.15
0.30
±0.15
0.30
±0.15
0.50
±0.15
P
(0.50)
(0.80)
(0.80)
(1.27)
G
0.30
±0.15
0.45
±0.15
0.45
±0.15
0.55
±0.15
Mass (Weight)
[g/1000 pcs.]
3.0
5.0
10
30
( ) Reference
(3) Flat Terminal type
A1
A2
EXB18V
G
T
G
W
P
L
B
B
Type
(inches)
EXB18V (0201 4)
Dimensions (mm)
L
1.40
±0.10
W
0.60
±0.10
T
0.35
±0.10
A1
0.20
±0.10
A2
0.20
±0.10
B
0.10
±0.10
P
(0.40)
G
0.20
±0.10
Mass (Weight)
[g/1000 pcs.]
1.0
( ) Reference
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Array
■
Ratings
Item
Resistance Range
Resistance Tolerance
14V,24V,V4V,34V
Specifications
10 to 1 M :E24 series
J: ±5 %
4 terminal
Item
14V,18V
(1)
Limiting Element Voltage
2HV
Max. Rated Continuous
24V,28V,N8V,38V,34V,V4V,V8V
Working Voltage
S8V
Specifications
12.5 V
25 V
50 V
100 V
25 V
50 V
200 V
±200 10
-6
/°C(ppm/°C)
(
)
Number of Terminals
18V,28V,N8V,38V,V8V,S8V
8 terminal
2HV
14V,24V,V4V,34V
16 terminal
2 terminal
T.C.R.
Max. Over-load Voltage
(2)
14V,18V
2HV
S8V
24V,28V,N8V,38V,34V,V4V,V8V
100 V
Number of Resistors
18V,28V,N8V,38V,V8V,S8V
4 terminal
2HV
14V,28V,N8V
18V
Power Rating at 70 °C
24V,V4V,34V,V8V,38V
S8V
2HV
8 terminal
0.031 W/element
0.031 W/element
(0.1 W/package)
0.063 W/element
0.1 W/element
0.063 W/element
(0.25 W/package)
Category Temperature Range
(Operating Temperature Range)
14V,18V
Jumper Array
S8V
14V,18V
S8V
–55 °C to 125 °C
0.5 A
2A
1A
4A
Rated Current
2HV,24V,28V,N8V,38V,34V,V4V,V8V
1 A
Max, Overload Current
2HV,24V,28V,N8V,38V,34V,V4V,V8V
2 A
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating Resistance Value, or Limiting Element Voltage (max.
RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload (Voltage) listed above whichever less.
100
Rated Load (%)
–55
°C
70
°C
Power Derating Curve
For resistors operated in ambient temperature above
70 °C, power rating shall be derated in accordance
with the figure on the right.
80
60
40
20
0
–60 –40 –20 0
125
°C
20 40 60 80 100 120 140 160 180
Ambient Temperature (°C)
■
Packaging Methods (Taping)
●
Standard Quantity
Type
EXB14V, 18V
EXB24V, 28V
EXBN8V
EXB2HV
EXB34V, 38V
EXBV4V, V8V
EXBS8V
Embossed Carrier Taping
Punched Carrier Taping
4 mm
5000 pcs./reel
2500 pcs./reel
2 mm
10000 pcs./reel
Kind of Taping
Pitch (P
1
)
Quantity
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Array
●
Carrier Tape
Punched Carrier
Embossed Carrier
fD
0
E
P
1
P
2
P
0
Unit (mm)
F
B
T
T
A
P
1
(2 mm pitch)
fD
1
(Only Emboss)
W
Type
EXB14V
EXB18V
EXB24V
EXB28V
EXBN8V
EXB2HV
EXB34V
EXB38V
EXBV4V
EXBV8V
EXBS8V
A
0.70
+0.10
–0.05
B
0.90
+0.10
–0.05
W
F
E
P
1
P
2
P
0
fD
0
T
fD
1
1.60
±0.10
1.20
±0.10
2.00
±0.10
0.52
±0.05
1.20
±0.10
2.20
±0.10
4.10
±0.15
8.00
±0.20
3.50
±0.05
1.75
±0.10
2.00
±0.05
4.00
±0.10
1.50
+0.10
–0
_
0.70
±0.05
1.95
±0.20
1.95
±0.15
3.60
±0.20
1.95
±0.20
3.60
±0.20
2.80
±0.20
5.70
±0.20
12.00
±0.30
5.50
±0.20
4.00
±0.10
0.84
±0.05
1.60 max. 1.50
+0.10
–0
●
Taping Reel
T
Unit (mm)
Type
EXB14V,18V
EXB24V,28V
EXBN8V
EXB2HV
EXB34V,38V
EXBV4V,V8V
EXBS8V
fA
fB
fC
W
T
fC
fB
180.0
+0
60 min. 13.0
±1.0
–3.0
9.0
±1.0
11.4
±1.0
13.0
±1.0
15.4
±2.0
fA
W
■
Land pattern design
Recommended land pattern design for Network chip is shown below.
(Not to scale)
Type
14V
f
a
Dimensions
a
b
c
p
0.50
0.40
0.65
0.80
0.80
1.27
Unit (mm)
f
0.80 to 0.90
0.80 to 0.90
1.4 to 1.5
2 to 2.4
2.2 to 2.6
3.2 to 3.8
0.20 to 0.30 0.25 to 0.30 0.25 to 0.30
0.20 to 0.30 0.15 to 0.20 0.15 to 0.20
0.5
0.7 to 0.9
0.7 to 0.9
1 to 1.2
0.35 to 0.40 0.35 to 0.40
0.4 to 0.45
0.4 to 0.5
0.5 to 0.75
0.4 to 0.45
0.4 to 0.5
0.5 to 0.75
18V
24V
V4V,V8V
b
p
c
34V,38V
S8V
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Array
f
a
f
a
b
d c d c d
b
b
d c d c d c d c d c d c d
b
Type
28V
N8V
(Not to scale)
Dimensions
Unit (mm)
a
b
c
d
f
0.40
0.525
0.25
0.25
1.40
0.45 to 0.50 0.35 to 0.38
0.25
0.25
1.40 to 2.00
Type
2HV
a
1.00
(Not to scale)
Dimensions
Unit (mm)
b
c
d
f
0.425
0.25
0.25
2.00
■
Recommended Soldering Conditions
Recommendations and precautions are described below.
●
Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Peak
Temperature
Preheating
Heating
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
●
Flow soldering
· We do not recommend flow soldering, because a solder bridge may form.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip Resistor Array (hereafter called the
resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
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