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LM2904M/NOPB

Description
IC DUAL OP-AMP, 10000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size997KB,25 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Environmental Compliance
Stay tuned Parametric Compare

LM2904M/NOPB Overview

IC DUAL OP-AMP, 10000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier

LM2904M/NOPB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNational Semiconductor(TI )
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum average bias current (IIB)0.05 µA
Maximum bias current (IIB) at 25C0.25 µA
Minimum Common Mode Rejection Ratio50 dB
Nominal Common Mode Rejection Ratio70 dB
frequency compensationYES
Maximum input offset voltage10000 µV
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
low-dissonanceNO
Humidity sensitivity level1
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions2
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingRAIL
Peak Reflow Temperature (Celsius)260
power supply+-1.5/+-13/3/26 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Nominal slew rate0.1 V/us
Maximum slew rate2 mA
Supply voltage upper limit26 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyBIPOLAR
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
Nominal Uniform Gain Bandwidth1000 kHz
Minimum voltage gain15000
width3.9 mm

LM2904M/NOPB Related Products

LM2904M/NOPB LM2904ITP/NOPB LM2904ITPX/NOPB LM2904MX/NOPB LM2904N/NOPB
Description IC DUAL OP-AMP, 10000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 10000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, BUMP, SMD-8, Operational Amplifier IC DUAL OP-AMP, 10000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, BUMP, SMD-8, Operational Amplifier IC DUAL OP-AMP, 10000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 10000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8, Operational Amplifier
Is it Rohs certified? conform to conform to conform to conform to conform to
Parts packaging code SOIC BGA BGA SOIC DIP
package instruction SOP, SOP8,.25 FBGA, BGA8,3X3,20 FBGA, BGA8,3X3,20 SOP, SOP8,.25 DIP, DIP8,.3
Contacts 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Maximum average bias current (IIB) 0.05 µA 0.05 µA 0.05 µA 0.05 µA 0.05 µA
Maximum bias current (IIB) at 25C 0.25 µA 0.25 µA 0.25 µA 0.25 µA 0.25 µA
Nominal Common Mode Rejection Ratio 70 dB 70 dB 70 dB 70 dB 70 dB
frequency compensation YES YES YES YES YES
Maximum input offset voltage 10000 µV 10000 µV 10000 µV 10000 µV 10000 µV
JESD-30 code R-PDSO-G8 S-PBGA-B8 S-PBGA-B8 R-PDSO-G8 R-PDIP-T8
JESD-609 code e3 e1 e1 e3 e3
length 4.9 mm 1.285 mm 1.285 mm 4.9 mm 9.817 mm
low-dissonance NO NO NO NO NO
Humidity sensitivity level 1 1 1 1 1
Number of functions 2 2 2 2 2
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP FBGA FBGA SOP DIP
Encapsulate equivalent code SOP8,.25 BGA8,3X3,20 BGA8,3X3,20 SOP8,.25 DIP8,.3
Package shape RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply +-1.5/+-13/3/26 V +-1.5/+-13/3/26 V +-1.5/+-13/3/26 V +-1.5/+-13/3/26 V +-1.5/+-13/3/26 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 2 mA 2 mA 2 mA 2 mA 2 mA
Supply voltage upper limit 26 V 26 V 26 V 26 V 26 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING BALL BALL GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 0.5 mm 0.5 mm 1.27 mm 2.54 mm
Terminal location DUAL BOTTOM BOTTOM DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40 40
Nominal Uniform Gain Bandwidth 1000 kHz 1000 kHz 1000 kHz 1000 kHz 1000 kHz
Minimum voltage gain 15000 15000 15000 15000 25000
width 3.9 mm 1.285 mm 1.285 mm 3.9 mm 7.62 mm
Maker National Semiconductor(TI ) - - National Semiconductor(TI ) National Semiconductor(TI )
Minimum Common Mode Rejection Ratio 50 dB - - 50 dB 50 dB
method of packing RAIL - - TAPE AND REEL RAIL
Maximum seat height 1.75 mm - - 1.75 mm 5.08 mm
Nominal slew rate 0.1 V/us - - 0.1 V/us 0.1 V/us
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