|
LM8333FLQ8Y/NOPB |
LM8333FLQ8X/NOPB |
LM8333GGR8X |
LM8333GGR8/NOPB |
| Description |
IC SPECIALTY MICROPROCESSOR CIRCUIT, QCC32, ROHS COMPLIANT, LLP-32, Microprocessor IC:Other |
IC SPECIALTY MICROPROCESSOR CIRCUIT, QCC32, ROHS COMPLIANT, LLP-32, Microprocessor IC:Other |
IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA49, MICRO ARRAY-49, Microprocessor IC:Other |
IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA49, ROHS COMPLIANT, MICRO ARRAY-49, Microprocessor IC:Other |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| package instruction |
HVQCCN, LCC32,.2SQ,20 |
HVQCCN, LCC32,.2SQ,20 |
MICRO ARRAY-49 |
ROHS COMPLIANT, MICRO ARRAY-49 |
| Reach Compliance Code |
compliant |
compliant |
unknown |
unknown |
| JESD-30 code |
S-XQCC-N32 |
S-XQCC-N32 |
S-PBGA-B49 |
S-PBGA-B49 |
| JESD-609 code |
e3 |
e3 |
e1 |
e1 |
| length |
6 mm |
6 mm |
4 mm |
4 mm |
| Humidity sensitivity level |
3 |
3 |
1 |
1 |
| Number of terminals |
32 |
32 |
49 |
49 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HVQCCN |
HVQCCN |
TFBGA |
TFBGA |
| Encapsulate equivalent code |
LCC32,.2SQ,20 |
LCC32,.2SQ,20 |
BGA49,7X7,20 |
BGA49,7X7,20 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
| power supply |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
0.8 mm |
0.8 mm |
1.1 mm |
1.1 mm |
| Maximum slew rate |
6 mA |
6 mA |
6 mA |
6 mA |
| Maximum supply voltage |
2.9 V |
2.9 V |
2.75 V |
2.9 V |
| Minimum supply voltage |
2.25 V |
2.25 V |
2.25 V |
2.25 V |
| Nominal supply voltage |
2.75 V |
2.75 V |
2.5 V |
2.75 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
NO LEAD |
NO LEAD |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
QUAD |
QUAD |
BOTTOM |
BOTTOM |
| width |
6 mm |
6 mm |
4 mm |
4 mm |
| uPs/uCs/peripheral integrated circuit type |
MICROPROCESSOR CIRCUIT |
MICROPROCESSOR CIRCUIT |
MICROPROCESSOR CIRCUIT |
MICROPROCESSOR CIRCUIT |
| ECCN code |
EAR99 |
EAR99 |
- |
EAR99 |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
- |
260 |
| Maximum time at peak reflow temperature |
40 |
40 |
- |
40 |