Avago Technologies’ ADA-4543 is an economical, easy-to-
use, general purpose silicon bipolar RFIC gain block am-
plifiers housed in a 4-lead SC-70 (SOT-343) surface mount
plastic package which requires only half the board space
of a SOT-143 package.
The Darlington feedback structure provides inherent
broad bandwidth performance, resulting in useful oper-
ating frequency up to 2.5 GHz. This is an ideal device for
small-signal gain cascades or IF amplification.
ADA-4543 is fabricated using Avago’s HP25 silicon bi-
polar process, which employs a double-diffused single
polysilicon process with self-aligned submicron emitter
geometry. The process is capable of simultaneous high fT
and high NPN breakdown (25 GHz fT at 6V BVCEO). The
process utilizes industry standard device oxide isolation
technologies and submicron aluminum multilayer inter-
connect to achieve superior performance, high uniformi-
ty, and proven reliability.
Surface Mount Package
SOT-343
Features
• Small Signal gain amplifier
• Operating frequency DC – 2.5 GHz
• Unconditionally stable
• 50 Ohms input & output
• Flat, Broadband Frequency Response up to 1 GHz
• Operating Current: 10 to 30 mA
• Industry standard SOT-343 package
• Lead-free option available
Specifications
900 MHz, 3.4V, 15 mA (typ.)
• 15.1 dB associated gain
• 1.9 dBm P
1dB
• 15 dBm OIP
3
• 3.7 dB noise figure
• VSWR < 2 throughput operating frequency
• Single supply, typical I
d
= 15 mA
Applications
• Cellular/PCS/WLL base stations
• Wireless data/WLAN
• Fiber-optic systems
• ISM
Attention:
Observe precautions for handling
electrostatic sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 1B)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
Pin Connections and Package Marking
GND
1Tx
RFout
& Vd
GND
RFin
Note:
Top View. Package marking provides orientation and identification.
“1T” = Device Code
“x” = Date code character
identifies month of manufacture.
Typical Biasing Configuration
V -V
Rc = cc d
Id
V
CC
=
5
V
R
c
C
bypass
RFC
C
block
RF
input
1Tx
C
block
V
d
= 3.4 V
RF
output
ADA-4543 Absolute Maximum Ratings
[1]
Symbol
I
d
P
diss
P
in max.
T
j
T
STG
θ
jc
Parameter
Device Current
Total Power Dissipation
[2]
RF Input Power
Channel Temperature
Storage Temperature
Thermal Resistance
[3]
Units
mA
mW
dBm
°C
°C
°C/W
Absolute
Maximum
40
145
13
150
-65 to 150
152
Notes:
1. Operation of this device above any one of
these parameters may cause permanent
damage.
2. Ground lead temperature is 25°C. Derate
6.6 mW/°C for TL >128°C.
3. Junction-to-case thermal resistance
measured using 150°C Liquid Crystal
Measurement method.
ADA-4543 Electrical Specifications
T
A
= 25°C, Zo=50Ω, Pin = -25 dBm, I
d
= 15 mA (unless specified otherwise)
Symbol
V
d
Gp
ΔGp
F
3dB
VSWR
in
VSWR
out
NF
P
1dB
OIP
3
DV/dT
Parameter and Test Condition:
I
d
= 15 mA, Zo = 50Ω
Device Voltage I
d
= 15 mA
Power Gain (|S
21
|
2
Gain Flatness
3 dB Bandwidth
Input Voltage Standing Wave Ratio
Output Voltage Standing Wave Ratio
50Ω Noise Figure
Output Power at 1dB Gain Compression
Output 3
rd
Order Intercept Point
Device Voltage Temperature Coefficient
Frequency
Units
V
Min.
3.1
13.5
Typ.
3.4
15.7
15.1
0.4
1.5
3.6
1.7:1
1.3:1
Max.
3.8
16.5
Std. Dev.
100 MHz
900 MHz
[1,2]
100 to 900 MHz
0.1 to 2 GHz
dB
dB
GHz
0.1 to 6 GHz
0.1 to 6 GHz
100 MHz
900 MHz
[1,2]
100 MHz
900 MHz
[1,2]
100 MHz
[3]
900 MHz
[1,2,3]
dB
dBm
dBm
mV/°C
3.6
3.7
2.5
1.9
14.6
15.0
-5.6
0.16
0.18
Notes:
1. Typical value determined from a sample size of 500 parts from 3 wafers.
2. Measurement obtained using production test board described in the block diagram below.
3. I) 900 MHz OIP
3
test condition: F1 = 900 MHz, F2 = 905 MHz and Pin = -25 dBm per tone.
II) 100 MHz OIP
3
test condition: F1 = 100 MHz, F2 = 105 MHz and Pin = -25 dBm per tone.
Input
50 Ohm
Transmission
(0.5 dB loss)
DUT
50 Ohm
Transmission
including Bias
(0.5 dB loss)
Output
Block diagram of 900 MHz production test board used for V
d
, Gain, P
1dB
, OIP
3
, and NF measurements.
Circuit losses have been de-embedded from actual measurements.
2
Product Consistency Distribution Charts at 900 MHz, I
d
= 15 mA
240
200
300
400
160
120
80
100
200
40
0
13
0
14
15
GAIN (dB)
16
17
3
3.2
3.4
V
d
(V)
3.6
3.8
4
Figure 1. Gain distribution @ 15 mA.
LSL = 13.5, Nominal = 15.1, USL = 16.5
Figure 2. V
d
distribution @ 15 mA.
LSL = 3.1, Nominal = 3.4, USL = 3.8
Notes:
1. Statistics distribution determined from a sample size of 500 parts taken from 3 different wafers.
2. Future wafers allocated to this product may have typical values anywhere between the minimum and maximum specification limits.
ADA-4543 Typical Performance Curves
(at 25°C, unless specified otherwise)
20
10
20
15
GAIN (dB)
P
1dB
(dBm)
5
OIP
3
(dBm)
15
10
0
10
5
-5
5
0
0
1
2
3
4
5
6
FREQUENCY (GHz)
-10
0
1
2
3
4
5
6
FREQUENCY (GHz)
0
0
1
2
3
4
5
6
FREQUENCY (GHz)
Figure 3. Gain vs. Frequency at Id = 15 mA.
Figure 4. P1dB vs. Frequency at Id =15 mA.
Figure 5. OIP3 vs. Frequency at Id =15 mA.
6
35
30
18
17
-40°C
16
GAIN (dB)
5
NF (dB)
Id (mA)
25
20
15
10
5
25°C
85°C
4
15
-40°C
14
13
12
0
10
20
Id (mA)
30
40
25°C
85°C
3
2
0
1
2
3
4
5
6
FREQUENCY (GHz)
0
0
1
2
Vd (V)
3
4
5
Figure 6. NF vs Frequency at Id =15 mA.
Figure 7. Id vs. Vd and Temperature.
Figure 8. Gain vs. Id and Temperature at 900 MHz.
3
ADA-4543 Typical Performance Curves
(at 25°C, unless specified otherwise)
, continued
15
10
5
0
-40°C
-5
-10
-15
0
10
20
Id (mA)
30
40
25°C
85°C
30
25
20
15
-40°C
10
5
0
0
10
20
Id (mA)
30
40
25°C
85°C
2
1
0
0
10
20
Id (mA)
30
40
NF (dB)
6
5
4
3
-40°C
25°C
85°C
P1dB (dBm)
Figure 9. P1dB vs. Id and Temperature
at 900 MHz.
18
OIP3 (dBm)
Figure 10. OIP3 vs. Id and Temperature
at 900 MHz.
20
15
10
5
0
-5
-10
0.1
0.5
0.9
1.5
2.0
2.5
3
4
5
6
Figure 11. NF vs. Id and Temperature
at 900 MHz.
30
0.1
0.5
0.9
1.5
2.0
2.5
3
4
16
GAIN (dB)
0.1
0.5
0.9
1.5
2.0
2.5
3
25
OIP
3
(dBm)
P
1dB
(dBm)
14
4
5
20
12
6
15
5
6
10
10
8
0
10
20
Id (mA)
30
40
5
0
10
20
Id (mA)
30
40
0
10
20
Id (mA)
30
40
Figure 12. Gain vs. Id and Frequency (GHz).
Figure 13. P1dB vs. Id and Frequency (GHz).
Figure 14. OIP3 vs. Id and Frequency (GHz).
5
6
0
-5
-10
4
3
2.5
2.0
1.5
0.9
0.5
0.1
-5
-10
-15
ORL (dB)
4.5
NF (dB)
5
IRL (dB)
-15
-20
-25
-30
Id=12 mA
Id=15 mA
Id=20 mA
Id=30 mA
-20
-25
-30
-35
-40
Id=12 mA
Id=15 mA
Id=20 mA
Id=30 mA
4
3.5
3
-35
0
10
20
Id (mA)
30
40
0
2
4
6
8
10
12
FREQUENCY (GHz)
0
2
4
6
8
10
12
FREQUENCY (GHz)
Figure 15. NF vs. Id and Frequency (GHz).
Figure 16. Input Return Loss vs. Id
and Frequency (GHz).
Figure 17. Output Return Loss vs. Id
and Frequency (GHz).
4
ADA-4543 Typical Scattering Parameters,
T
A
= 25°C, I
d
= 12 mA
Freq.
GHz
0.1
0.5
0.9
1.0
1.5
1.9
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
S
11
Mag.
0.071
0.112
0.184
0.198
0.257
0.282
0.29
0.307
0.31
0.303
0.287
0.273
0.258
0.253
0.259
0.254
0.25
0.25
0.266
0.294
0.346
0.399
0.454
Ang.
4.9
24.8
24.2
21.6
5.9
-4.5
-7.8
-19.4
-30.7
-43.3
-58
-74.8
-94.3
-116.3
-136.7
-156.4
-177.8
157
131
106.9
87.1
70.1
57.4
dB
14.38
14.24
13.98
13.90
13.51
13.15
13.09
12.72
12.40
12.07
11.74
11.45
11.05
10.67
10.24
9.83
9.43
8.97
8.45
7.79
7.17
6.39
5.73
S
21
Mag.
5.234
5.15
4.998
4.956
4.735
4.547
4.513
4.326
4.168
4.013
3.865
3.736
3.568
3.416
3.251
3.101
2.961
2.81
2.645
2.453
2.284
2.088
1.935
S
12
Ang.
176.2
162.1
148.3
144.9
129.3
117.1
114.2
99.8
85.9
72.2
58.5
45
31.4
18.2
5
-7.7
-20.5
-33.5
-46.4
-59.1
-71
-83.5
-94.8
S
22
Ang.
-0.9
-4.6
-7.6
-8.3
-10.9
-12.6
-13.1
-14.8
-16.1
-17.2
-18
-18.5
-19.2
-19.8
-21
-22.8
-26.1
-31.1
-37.1
-43.2
-49
-55.7
-62.9
K
Ang.
-3.2
-3.8
-6
-7.7
-18.7
-27.2
-29.1
-38
-46.8
-57
-69.3
-87
-106.9
-126.3
-144.9
-163.1
173.8
143.7
111.8
87.5
71.6
60.3
50.8
1.1
1.1
1.1
1.1
1.1
1.2
1.2
1.2
1.2
1.3
1.3
1.3
1.4
1.4
1.3
1.3
1.3
1.2
1.2
1.2
1.2
1.1
1.1
Mag.
0.125
0.123
0.12
0.119
0.116
0.113
0.113
0.111
0.109
0.109
0.109
0.111
0.113
0.118
0.125
0.135
0.148
0.161
0.172
0.181
0.192
0.204
0.213
Mag.
0.146
0.15
0.183
0.191
0.207
0.213
0.212
0.203
0.185
0.162
0.139
0.12
0.11
0.114
0.122
0.121
0.116
0.116
0.134
0.171
0.223
0.281
0.339
Notes:
1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead. The
output reference plane is at the end of the output lead.
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