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HX6218DENC

Description
FIFO, 2KX18, 30ns, Synchronous, CMOS, CQFP68, CERAMIC, QFP-68
Categorystorage    storage   
File Size718KB,15 Pages
ManufacturerHoneywell
Websitehttp://www.ssec.honeywell.com/
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HX6218DENC Overview

FIFO, 2KX18, 30ns, Synchronous, CMOS, CQFP68, CERAMIC, QFP-68

HX6218DENC Parametric

Parameter NameAttribute value
MakerHoneywell
Parts packaging codeQFP
package instructionQFF, QFP68,.99SQ,50
Contacts68
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time30 ns
Maximum clock frequency (fCLK)29.4 MHz
period time36 ns
JESD-30 codeS-CQFP-F68
length24.13 mm
memory density36864 bit
Memory IC TypeOTHER FIFO
memory width18
Number of functions1
Number of terminals68
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX18
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFF
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height2.5908 mm
Maximum standby current0.0005 A
Maximum slew rate0.5 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationQUAD
width24.13 mm
FIFO – HX6409/HX6218/HX6136
First-In First-Out Memory
HX6409/HX6218/HX6136
The HX6409, HX6218, and HX6136 are high speed,
low power, first-in first-out memories with clocked read
and write interfaces. The HX6409 is a 4096-word by 9-
bit memory array; the HX6218 is a 2048-word by 18-bit
memory array; and the HX6136 is a 1024-word by 36-
bit memory array. The FIFOs support width expansion
while depth expansion requires external logic control
using state machine techniques. Features include
programmable parity control, an empty/full flag, a
quarter/three quarter full flag, a half full flag and an
error flag.
Honeywell’s FIFOs provide solutions for a wide variety
of data buffering needs, including high-speed data
acquisition, multiprocessor interfaces, and
communications buffering.
Input ports are controlled by a free running clock (CKW)
and a write-enable pin ENW. When ENW is asserted,
data is written into the FIFO on the rising edge of the
CKW signal. While ENW is held active, data is
continually written into the FIFO on each CKW cycle.
The output port is controlled in a similar manner by a
freerunning read clock (CKR) and a read enable pin
(ENR). In addition, the three FIFOs have an output
enable pin (OE) and a master reset pin (MR). The read
(CKR) and write (CKW) clocks may be tied together for
Honeywell’s enhanced SOI RICMOS™ IV (Radiation
Insensitive CMOS) technology is radiation hardened
through the use of advanced and proprietary design,
layout and process hardening techniques. The FIFO is
fabricated with Honeywell’s radiation-hardened
technology, and is designed for use in systems
operating in radiation environments. The SOI
RICMOS™ IV process is a 5-volt, SOI CMOS
technology with a 150 Å gate oxide and a minimum
drawn feature size of 0.8µm, (0.65µm effective gate
length—L
eff
). Additional features include tungsten via
plugs, Honeywell’s proprietary SHARP planarization
process, and a lightly doped drain (LDD) structure.
single-clock operation or the two clocks may be run
independently for asynchronous read/write applications.
Clock frequencies up to 28 MHz are achievable in the
three configurations.
FEATURES
1K x 36, 2K x 18, 4K x 9
configurations
Fabricated with RICMOS™ IV
Silicon on Insulator (SOI) 0.8
µm process (Leff = 0.65µm)
Total dose hardness through
1x10
6
rad(Si)
Neutron hardness through
1x10
14
cm
-2
Dynamic and static transient
upset hardness through 1x10
9
rad(Si)/s
Dose rate survivability through
1x10
11
rad(Si)/s
Soft error rate of <1x10
-10
upsets/bit-day
No latchup
Read/write cycle times
36 ns (-55°to 125°C)
Expandable in Width
Empty, full, half full, 1/4 full,
¾ full, error flags
Parity generation/checking
Fully asynchronous with
simultaneous read and write
operation
Output enable (OE)
CMOS or TTL compatible I/O
Single 5V ±10% power supply
Various flat pack options
www.honeywell.com
1

HX6218DENC Related Products

HX6218DENC HX6136FENC HX6409TENC HX6218DENT HX6136FENT HX6409TENT
Description FIFO, 2KX18, 30ns, Synchronous, CMOS, CQFP68, CERAMIC, QFP-68 FIFO, 1KX36, 30ns, Synchronous, CMOS, CQFP132, CERAMIC, QFP-132 FIFO, 4KX9, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, DFP-32 FIFO, 2KX18, 30ns, Synchronous, CMOS, CQFP68, CERAMIC, QFP-68 FIFO, 1KX36, 30ns, Synchronous, CMOS, CQFP132, CERAMIC, QFP-132 FIFO, 4KX9, 30ns, Synchronous, CMOS, CDFP32, CERAMIC, DFP-32
Parts packaging code QFP QFP DFP QFP QFP DFP
package instruction QFF, QFP68,.99SQ,50 GQFF, TPAK132,2.5SQ,25 DFP, FL32,.6 QFF, QFP68,.99SQ,50 GQFF, TPAK132,2.5SQ,25 DFP, FL32,.6
Contacts 68 132 32 68 132 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 30 ns 30 ns 30 ns 30 ns 30 ns 30 ns
Maximum clock frequency (fCLK) 29.4 MHz 29.4 MHz 29.4 MHz 29.4 MHz 29.4 MHz 29.4 MHz
period time 36 ns 36 ns 36 ns 36 ns 36 ns 36 ns
JESD-30 code S-CQFP-F68 S-CQFP-F132 R-CDFP-F32 S-CQFP-F68 S-CQFP-F132 R-CDFP-F32
length 24.13 mm 24.13 mm 20.828 mm 24.13 mm 24.13 mm 20.828 mm
memory density 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 18 36 9 18 36 9
Number of functions 1 1 1 1 1 1
Number of terminals 68 132 32 68 132 32
word count 2048 words 1024 words 4096 words 2048 words 1024 words 4096 words
character code 2000 1000 4000 2000 1000 4000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 2KX18 1KX36 4KX9 2KX18 1KX36 4KX9
Exportable YES YES YES YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QFF GQFF DFP QFF GQFF DFP
Encapsulate equivalent code QFP68,.99SQ,50 TPAK132,2.5SQ,25 FL32,.6 QFP68,.99SQ,50 TPAK132,2.5SQ,25 FL32,.6
Package shape SQUARE SQUARE RECTANGULAR SQUARE SQUARE RECTANGULAR
Package form FLATPACK FLATPACK, GUARD RING FLATPACK FLATPACK FLATPACK, GUARD RING FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum seat height 2.5908 mm 2.7686 mm 3.81 mm 2.5908 mm 2.7686 mm 3.81 mm
Maximum standby current 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A
Maximum slew rate 0.5 mA 0.5 mA 0.5 mA 0.5 mA 0.5 mA 0.5 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form FLAT FLAT FLAT FLAT FLAT FLAT
Terminal pitch 1.27 mm 0.635 mm 1.524 mm 1.27 mm 0.635 mm 1.524 mm
Terminal location QUAD QUAD DUAL QUAD QUAD DUAL
width 24.13 mm 24.13 mm 15.24 mm 24.13 mm 24.13 mm 15.24 mm
Maker Honeywell Honeywell - Honeywell Honeywell Honeywell
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