Field Programmable Gate Array, 62.5MHz, CMOS, PQCC28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMI Semiconductor |
| Reach Compliance Code | unknown |
| maximum clock frequency | 62.5 MHz |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| Number of entries | 22 |
| Output times | 20 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| PA7024J-2 | PA7024P-2 | PA7024J-1 | PA7024C-2 | PA7024C-1 | PA7024P-1 | |
|---|---|---|---|---|---|---|
| Description | Field Programmable Gate Array, 62.5MHz, CMOS, PQCC28, | Field Programmable Gate Array, 62.5MHz, CMOS, PDIP24, | EE PLD, 20ns, CMOS, PQCC28, PLASTIC, LCC-28 | Field Programmable Gate Array, 62.5MHz, CMOS, CDIP24, | EE PLD, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | EE PLD, 20ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| maximum clock frequency | 62.5 MHz | 62.5 MHz | 41.6 MHz | 62.5 MHz | 41.6 MHz | 41.6 MHz |
| JESD-30 code | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | R-XDIP-T24 | R-CDIP-T24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of entries | 22 | 22 | 22 | 22 | 22 | 22 |
| Output times | 20 | 20 | 20 | 20 | 20 | 20 |
| Number of terminals | 28 | 24 | 28 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | QCCJ | DIP | DIP | DIP |
| Encapsulate equivalent code | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | EE PLD | FIELD PROGRAMMABLE GATE ARRAY | EE PLD | EE PLD |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL |