|
IRFU321 |
IRFU322 |
IRFU320 |
| Description |
Power Field-Effect Transistor, 3.1A I(D), 350V, 1.8ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-251AA |
Power Field-Effect Transistor, 2.6A I(D), 400V, 2.5ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-251AA |
Power Field-Effect Transistor, 3.1A I(D), 400V, 1.8ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-251AA |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| Maker |
Harris |
Harris |
Harris |
| package instruction |
IN-LINE, R-PSIP-T3 |
IN-LINE, R-PSIP-T3 |
IN-LINE, R-PSIP-T3 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
| Avalanche Energy Efficiency Rating (Eas) |
190 mJ |
190 mJ |
190 mJ |
| Shell connection |
DRAIN |
DRAIN |
DRAIN |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage |
350 V |
400 V |
400 V |
| Maximum drain current (Abs) (ID) |
3.1 A |
2.6 A |
3.1 A |
| Maximum drain current (ID) |
3.1 A |
2.6 A |
3.1 A |
| Maximum drain-source on-resistance |
1.8 Ω |
2.5 Ω |
1.8 Ω |
| FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95 code |
TO-251AA |
TO-251AA |
TO-251AA |
| JESD-30 code |
R-PSIP-T3 |
R-PSIP-T3 |
R-PSIP-T3 |
| JESD-609 code |
e0 |
e0 |
e0 |
| Number of components |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
3 |
| Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
| Maximum operating temperature |
150 °C |
150 °C |
150 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
IN-LINE |
| Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
| Maximum power consumption environment |
50 W |
50 W |
50 W |
| Maximum power dissipation(Abs) |
50 W |
50 W |
42 W |
| Maximum pulsed drain current (IDM) |
12 A |
10 A |
12 A |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
NO |
NO |
NO |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal location |
SINGLE |
SINGLE |
SINGLE |
| transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
| Transistor component materials |
SILICON |
SILICON |
SILICON |
| Maximum off time (toff) |
65 ns |
65 ns |
65 ns |
| Maximum opening time (tons) |
36 ns |
36 ns |
36 ns |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |