. . . engineered solutions for the transient environment™
LC0406FC24C
BIDIRECTIONAL LOW CAPACIT
ANCE FLIP CHIP
APPLICA
TIONS
✔
Cellular Phones
✔
Handheld Electronics
✔
Personal Digital Assistants (PDAs)
✔
Notebook Computers
✔
SMART Cards
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
ESD Protection > 25 kilovolts
✔
Available in Six Voltage Types Ranging From 3.3V to 24V
✔
200 Watts Peak Pulse Power Dissipation per Line (8/20µs)
✔
Low Clamping Voltage
✔
LOW CAPACITANCE
✔
LOW STANDBY CURRENT
MECHANICAL CHARACTERISTICS
✔
Standard EIA Chip Size: 0406
✔
Weight 0.73 milligrams (Approximate)
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
✔
Top Contacts: Solder Bump 0.004” in Height (Nominal)
CIRCUIT DIAGRAM
0406
(Single Chip Shown)
05158.R2 11/02
1
www.protekdevices.com
LC0406FC3.3C
thru
LC0406FC24C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
J
T
STG
VALUE
200
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
11.0
13.2
19.8
25.4
37.2
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
TYPICAL
CAPACITANCE
V
WM
VOLTS
LC0406FC3.3C
LC0406FC05C
LC0406FC08C
LC0406FC12C
LC0406FC15C
LC0406FC24C
3.3
5.9
8.0
12.0
15.0
24.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.0
13.3
16.7
26.7
@8/20µs
V
C
@ I
PP
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
@V
WM
I
D
µA
75
10
1
1
1
1
0V @ 1 MHz
C
pF
70
35
32
30
25
20
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions. Electrical characteristics for 3V, 8V, 12V, 15V and 24V devices are preliminary.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
200W, 8/20µs Waveform
100
e
-t
t
d
= t I /2
PP
0
5
10
15
t - Time - µs
20
25
30
10
0.01
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
05158.R2 11/02
2
www.protekdevices.com
LC0406FC3.3C
thru
LC0406FC24C
GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
225°C
5-10 sec
60
200°C
Instantaneous
to 200°C
100
80
% Of Rated Power
FIGURE 4
REFLOW SOLDER PROFILE
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
Pre-Heat
Time
Soldering
Time
Cool Down
Time
100°C
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR LC0406FC05C
40
5 Volts per Division
30
20
10
0
ESD Test Pulse - 12 kilovolt, 1/30ns (waveshape)
14
12
10
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0406FC05C
V
C
- Clamping Voltage - Volts
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
15
20
05158.R2 11/02
3
www.protekdevices.com
LC0406FC3.3C
thru
LC0406FC24C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
0406
Picture Not Available
A
B
C
TOP
SIDE
PACKAGE DIMENSIONS
DIM
MILLIMETERS
INCHES
G
A
E
F
H
B
C
E
F
G
END
I
H
0.46 NOM
0.56 NOM
0.99 ± 0.0254
0.15 SQ
1.5 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.059 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
I
0.406 NOM
MOUNTING PAD - Option 1
C
A
D
PAD DIMENSIONS
DIM Millimeters
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
Inches
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
T
APE & REEL ORIENT TION
A
DIE
SOLDER
BUMPS
E
NOTE:
Preferred:
Using 0.1mm (0.004”)
stencil.
H
G
I
Triple Die - 0406
F
SOLDER PADS
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER MASK
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
06023 Rev3 -11/02
TAPE & REEL ORDERING INFORMATION:
Surface mount product is taped and reeled in accordance with EIA-481.
Plastic Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., LC0406FC05C-T75-1).
Paper Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., LC0406FC05C-T75-2).