SK12 thru SK110
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
VOLTAGE - 20 TO 100 VOLTS
CURRENT - 1.0 AMPERES
SMA/DO-214AC
.055(1.40)
.062(1.60)
.098(2.50)
.114(2.90)
.157(4.00)
.181(4.60)
.006(.152)
.012(.305)
.078(2.00)
.096(2.44)
.030(0.76)
.060(1.52)
.004(.102)
.008(.203)
.188(4.80)
.208(5.28)
Dimensions in inches and (millimeters)
FEATURES
For surface mount applications
Low profile package
Built-in strain relief
Easy pick and place
Low forward voltage drop
Metal to silicon rectifier, majority carrier conduction
Low power loss, high efficiency
High current and surge capability
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
High temperature soldering
250
o
C/10 seconds at terminsls
MECHANICAL DATA
Case JEDEC DO-214AC molded plastic
Terminals Solder plated, solderable per
MIL-STD-202, Method 208
Polarity Color band denotes cathode end
Standard Package 12mm tape (EIA STD EIA-481)
Weight 0.002 ounce, 0.064gram
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temperature unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load
For capacitive load, derate current by 20%
SYMBOL SK12
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current at T
L
(Figure 1)
Peak Forward Surge Current 8.3ms Single Half Sine-Wave
Superimposed on Rated Load (JEDEC Method)
Maximum Instantaneous Forward Voltage at 1.0A
Maximum DC Reverse Current (NOTE 1) T
A
=25 C
0
at Rated DC Blocking Voltage T
A
=100 C
Maximum Thermal Resistance (NOTE 2)
Operating Junction Temprature Range
Storage and Operating Temperature Range
R
R
0
SK13
30
21
30
SK14
40
28
40
SK15
50
35
50
SK16
60
42
60
SK18
80
56
80
SK19 SK110
90
64
90
100
71
100
UNITS
Volts
Volts
Volts
Amps
Amps
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
JA
JL
20
14
20
1.0
30
0.5
0.7
0.5
20
75
17
0.85
Volts
mA
0
C/W
0
T
J
T
STG
-55 to +125
-55 to +150
C
C
0
NOTES
1. Pulse test with 300 S pulse width, 1% duty cycle
2. P
.C.B. mounted on 0.2x0.2 (5.0x5.0mm) copper pad areas
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