K4T1G044QA
K4T1G084QA
K4T1G164QA
1Gb DDR2 SDRAM
1Gb A-die DDR2 SDRAM Specification
68FBGA & 84FBGA with Pb-Free
(RoHS compliant)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
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Rev. 1.4 March 2007
K4T1G044QA
K4T1G084QA
K4T1G164QA
1Gb DDR2 SDRAM
Table of Contents
1.0 Ordering Information ................................................................................................................... 4
2.0 Key Features ................................................................................................................................. 4
3.0 Package Pinout/Mechanical Dimension & Addressing ............................................................ 5
3.1 x4 package pinout (Top View) : 68ball FBGA Package (60balls + 8balls of dummy balls)
........................ 5
3.2 x8 package pinout (Top View) : 68ball FBGA Package (60balls + 8balls of dummy balls)
........................ 6
3.3 x16 package pinout (Top View) : 84ball FBGA Package
...................................................................... 7
3.4 FBGA Package Dimension(x4/x8)
.................................................................................................... 8
3.5 FBGA Package Dimension(x16)
....................................................................................................... 9
4.0 Input/Output Functional Description ........................................................................................ 10
5.0 DDR2 SDRAM Addressing ........................................................................................................ 11
6.0 Absolute Maximum DC Ratings ................................................................................................ 12
7.0 AC & DC Operating Conditions ................................................................................................ 12
...................................................................... 12
7.2 Operating Temperature Condition
................................................................................................. 13
7.3 Input DC Logic Level
................................................................................................................... 13
7.4 Input AC Logic Level
................................................................................................................... 13
7.5 AC Input Test Conditions
............................................................................................................. 13
7.6 Differential input AC logic Level
.................................................................................................... 14
7.7 Differential AC output parameters
................................................................................................. 14
8.0 ODT DC Electrical Characteristics ........................................................................................... 14
9.0 OCD default characteristics ...................................................................................................... 15
10.0 IDD Specification Parameters and Test Conditions ............................................................. 16
11.0 DDR2 SDRAM IDD Spec Table ................................................................................................ 18
12.0 Input/Output Capacitance ....................................................................................................... 19
13.0 Electrical Characteristics & AC Timing for DDR2-667/533/400 ............................................ 19
13.1 Refresh Parameters by Device Density
...................................................................................... 19
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
........................................... 19
13.3 Timing Parameters by Speed Grade
.......................................................................................... 20
14.0 General Notes, which may apply for all AC parameters ....................................................... 22
15.0 Specific Notes for dedicated AC parameters ........................................................................ 24
7.1 Recommended DC Operating Conditions (SSTL - 1.8)
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Rev. 1.4 March 2007
K4T1G044QA
K4T1G084QA
K4T1G164QA
1Gb DDR2 SDRAM
Year
2005
2005
2006
2006
2007
- Initial Release
- Revised IDD Spec Table
- Corrected typo in Package Pinout/Mechanical Dimension
- Added the detailed explanation on the notes for AC parameters
- Corrected typo
- Added data setup and hold time derating values for single-end DQS
History
Revision History
Revision
1.0
1.1
1.2
1.3
1.4
Month
July
August
September
October
March
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Rev. 1.4 March 2007
K4T1G044QA
K4T1G084QA
K4T1G164QA
1.0 Ordering Information
Organization
256Mx4
128Mx8
64Mx16
DDR2-667 5-5-5
K4T1G044QA-ZCE6
K4T1G084QA-ZCE6
K4T1G164QA-ZCE6
DDR2-533 4-4-4
K4T1G044QA-ZCD5
K4T1G084QA-ZCD5
K4T1G164QA-ZCD5
1Gb DDR2 SDRAM
DDR2-400 3-3-3
K4T1G044QA-ZCCC
K4T1G084QA-ZCCC
K4T1G164QA-ZCCC
Package
68 FBGA
68 FBGA
84 FBGA
Note :
1. Speed bin is in order of CL-tRCD-tRP.
2 . x4/x8 Package - including 8 dummy balls.
2.0 Key Features
Speed
CAS Latency
tRCD(min)
tRP(min)
tRC(min)
DDR2-667 5-5-5
5
15
15
54
DDR2-533 4-4-4
4
15
15
55
DDR2-400 3-3-3
3
15
15
55
Units
tCK
ns
ns
ns
• JEDEC standard 1.8V ± 0.1V Power Supply
• VDDQ = 1.8V ± 0.1V
• 200 MHz f
CK
for 400Mb/sec/pin, 267MHz f
CK
for 533Mb/sec/
pin, 333MHz f
CK
for 667Mb/sec/pin
• 8 Banks
• Posted CAS
• Programmable CAS Latency: 3, 4, 5
• Programmable Additive Latency: 0, 1 , 2 , 3 and 4
• Write Latency(WL) = Read Latency(RL) -1
• Burst Length: 4 , 8(Interleave/nibble sequential)
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe (Single-ended data-
strobe is an optional feature)
• Off-Chip Driver(OCD) Impedance Adjustment
• On Die Termination
• Special Function Support
- PASR(Partial Array Self Refresh)
- 50ohm ODT
- High Temperature Self-Refresh rate enable
• Average Refresh Period 7.8us at lower than T
CASE
85°C,
3.9us at 85°C < T
CASE
< 95
°C
•
Package: 68ball FBGA - 256Mx4/128Mx8 , 84ball FBGA -
The 1Gb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x 8
banks, 16Mbit x 8 I/Os x 8banks or 8Mbit x 16 I/Os x 8 banks
device. This synchronous device achieves high speed double-
data-rate transfer rates of up to 667Mb/sec/pin (DDR2-667) for
general applications.
The chip is designed to comply with the following key DDR2
SDRAM features such as posted CAS with additive latency, write
latency = read latency - 1, Off-Chip Driver(OCD) impedance
adjustment and On Die Termination.
All of the control and address inputs are synchronized with a pair
of externally supplied differential clocks. Inputs are latched at the
crosspoint of differential clocks (CK rising and CK falling). All I/Os
are synchronized with a pair of bidirectional strobes (DQS and
DQS) in a source synchronous fashion. The address bus is used
to convey row, column, and bank address information in a RAS/
CAS multiplexing style. For example, 1Gb(x4) device receive 14/
11/3 addressing.
The 1Gb DDR2 device operates with a single 1.8V ± 0.1V power
supply and 1.8V ± 0.1V VDDQ.
The 1Gb DDR2 device is available in 68ball FBGAs(x4/x8) and in
84ball FBGAs(x16).
Note : The functionality described and the timing specifications included in
this data sheet are for the DLL Enabled mode of operation.
64Mx16
• All of Lead-free products are compliant for RoHS
Note : This data sheet is an abstract of full DDR2 specification and does not cover the common features which are described in “DDR2 SDRAM Device
Operation & Timing Diagram”.
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Rev. 1.4 March 2007
K4T1G044QA
K4T1G084QA
K4T1G164QA
3.0 Package Pinout/Mechanical Dimension & Addressing
1Gb DDR2 SDRAM
3.1 x4 package pinout (Top View) : 68ball FBGA Package
(60balls + 8balls of dummy balls)
1
NC
2
NC
3
7
A
B
C
D
8
9
NC
NC
VDD
NC
VDDQ
NC
VDDL
NC
VSSQ
DQ1
VSSQ
VREF
CKE
VSS
E
F
G
H
J
K
L
M
N
P
R
T
U
V
VSSQ
DQS
VDDQ
DQ2
VSSDL
RAS
CAS
A2
A6
A11
NC
DQS
VSSQ
DQ0
VSSQ
CK
CK
CS
A0
A4
A8
A13
VDDQ
NC
VDDQ
NC
VDD
ODT
DM
VDDQ
DQ3
VSS
WE
BA1
A1
A5
A9
NC
BA2
BA0
A10/AP
VDD
VSS
A3
A7
VSS
VDD
A12
NC
NC
W
NC
NC
Note :
1. Pin E3 has identical capacitance as pin E7.
2. VDDL and VSSDL are power and ground for the DLL.
Ball Locations (x4)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
: Populated Ball
+ : Depopulated Ball
Top View
(See the balls through the Package)
2
3
4
5
6
7
8
9
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Rev. 1.4 March 2007
Electronics Design Contest
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