SN74AUP2G80YFPR datasheet, PDF

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SN74AUP2G80YFPR: DescriptionLow-Power Dual Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85; Categorylogic logic; File Size1MB，23 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74AUP2G80YFPR Overview

Low-Power Dual Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85

SN74AUP2G80YFPR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	VFBGA, BGA8,2X4,16
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
series	AUP/ULP/V
JESD-30 code	R-XBGA-B8
JESD-609 code	e1
length	1.57 mm
Load capacitance (CL)	30 pF
Logic integrated circuit type	D FLIP-FLOP
Maximum Frequency@Nom-Su	80000000 Hz
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of digits	1
Number of functions	2
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output polarity	TRUE
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA8,2X4,16
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	1.2/3.3 V
Maximum supply current (ICC)	0.0009 mA
Prop。Delay @ Nom-Su	28.7 ns
propagation delay (tpd)	28.7 ns
Certification status	Not Qualified
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	0.8 V
Nominal supply voltage (Vsup)	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.4 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
Trigger type	POSITIVE EDGE
width	0.77 mm
minfmax	260 MHz
Base Number Matches	1

SN74AUP2G80YFPR Related Products

	SN74AUP2G80YFPR	SN74AUP2G80DCUR	SN74AUP2G80DQER	SN74AUP2G80RSER
Description	Low-Power Dual Positive-Edge-Triggered D-Type Flip-Flop 8-DSBGA -40 to 85	Low-Power Dual Positive-Edge-Triggered D-Type Flip-Flop 8-VSSOP -40 to 85	Low-Power Dual Positive-Edge-Triggered D-Type Flip-Flop 8-X2SON -40 to 85	Low-Power Dual Positive-Edge-Triggered D-Type Flip-Flop 8-UQFN -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	BGA	SOIC	QFN	QFN
package instruction	VFBGA, BGA8,2X4,16	VSSOP, TSSOP8,.12,20	VSON, SOLCC8,.04,14	VQCCN, LCC8,.06SQ,20
Contacts	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99
series	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V
JESD-30 code	R-XBGA-B8	R-PDSO-G8	R-PDSO-N8	S-XQCC-N8
JESD-609 code	e1	e4	e4	e4
length	1.57 mm	2.3 mm	1.4 mm	1.5 mm
Load capacitance (CL)	30 pF	30 pF	30 pF	30 pF
Logic integrated circuit type	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
Maximum Frequency@Nom-Su	80000000 Hz	80000000 Hz	80000000 Hz	80000000 Hz
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A
Humidity sensitivity level	1	1	1	1
Number of digits	1	1	1	1
Number of functions	2	2	2	2
Number of terminals	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Output polarity	TRUE	TRUE	TRUE	TRUE
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	VFBGA	VSSOP	VSON	VQCCN
Encapsulate equivalent code	BGA8,2X4,16	TSSOP8,.12,20	SOLCC8,.04,14	LCC8,.06SQ,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE
method of packing	TR	TR	TR	TR
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V
Maximum supply current (ICC)	0.0009 mA	0.0009 mA	0.0009 mA	0.0009 mA
Prop。Delay @ Nom-Su	28.7 ns	28.7 ns	28.7 ns	28.7 ns
propagation delay (tpd)	28.7 ns	28.7 ns	28.7 ns	28.7 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.5 mm	0.9 mm	0.4 mm	0.6 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	0.8 V	0.8 V	0.8 V	0.8 V
Nominal supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal form	BALL	GULL WING	NO LEAD	NO LEAD
Terminal pitch	0.4 mm	0.5 mm	0.35 mm	0.5 mm
Terminal location	BOTTOM	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
width	0.77 mm	2 mm	1 mm	1.5 mm
minfmax	260 MHz	260 MHz	260 MHz	260 MHz
Factory Lead Time	1 week	6 weeks	-	6 weeks

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