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SN74AUP3G06DCUR

Description
Buffer/Driver 3-CH Inverting Open Drain CMOS 8-Pin VSSOP T/R
CategoryBuffer and line drives   
File Size1MB,22 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

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SN74AUP3G06DCUR Overview

Buffer/Driver 3-CH Inverting Open Drain CMOS 8-Pin VSSOP T/R

SN74AUP3G06DCUR Parametric

Parameter NameAttribute value
EU restricts the use of certain hazardous substancesCompliant
ECCN (US)EAR99
Part StatusActive
HTS8542.39.00.01
Logic FamilyAUP
Logic FunctionBuffer/Driver
Number of Elements per Chip3
Number of Channels per Chip3
Number of Inputs per Chip3
Number of Input Enables per Chip0
Number of Outputs per Chip3
Number of Output Enables per Chip0
Bus HoldNo
PolarityInverting
Maximum Propagation Delay Time @ Maximum CL (ns)10.7@1.8V|16@1.2V|12.3@1.5V|10.5@3.3V|7.1@2.5V
Absolute Propagation Delay Time (ns)19.3
Process TechnologyCMOS
Input Signal TypeSingle-Ended
Output TypeOpen Drain
Maximum Low Level Output Current (mA)4
Minimum Operating Supply Voltage (V)0.8
Typical Operating Supply Voltage (V)3.3|2.5|1.8
Maximum Operating Supply Voltage (V)3.6
Tolerant I/Os (V)3.6
Maximum Quiescent Current (uA)0.5
Propagation Delay Test Condition (pF)30
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
PackagingTape and Reel
Standard Package NameSOP
Pin Count8
Supplier PackageVSSOP
MountingSurface Mount
Package Height0.8(Max)
Package Length2.1(Max)
Package Width2.4(Max)
PCB changed8
Lead ShapeGull-wing

SN74AUP3G06DCUR Related Products

SN74AUP3G06DCUR SN74AUP3G06DQER SN74AUP3G06RSER SN74AUP3G06YFPR
Description Buffer/Driver 3-CH Inverting Open Drain CMOS 8-Pin VSSOP T/R Low-Power Triple Inverter Buffer/Driver With Open-Drain Outputs 8-X2SON -40 to 85 Low-Power Triple Inverter Buffer/Driver With Open-Drain Outputs 8-UQFN -40 to 85 Low-Power Triple Inverter Buffer/Driver With Open-Drain Outputs 8-DSBGA -40 to 85
Brand Name - Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? - Lead free Lead free Lead free
Is it Rohs certified? - conform to conform to conform to
Parts packaging code - QFN QFN BGA
package instruction - HSON, SOLCC8,.04,14 VQCCN, LCC8,.06SQ,20 VFBGA, BGA8,2X4,16
Contacts - 8 8 8
Reach Compliance Code - compli compli compli
ECCN code - EAR99 EAR99 EAR99
Counting direction - UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
series - AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 code - R-PDSO-N8 S-PQCC-N8 R-XBGA-B8
JESD-609 code - e4 e4 e1
length - 1.4 mm 1.5 mm 1.57 mm
Load capacitance (CL) - 30 pF 30 pF 30 pF
Logic integrated circuit type - BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) - 0.004 A 0.004 A 0.004 A
Humidity sensitivity level - 1 1 1
Number of digits - 1 1 1
Number of functions - 3 3 3
Number of ports - 2 2 2
Number of terminals - 8 8 8
Maximum operating temperature - 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C
Output characteristics - OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Output polarity - INVERTED INVERTED INVERTED
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code - HSON VQCCN VFBGA
Encapsulate equivalent code - SOLCC8,.04,14 LCC8,.06SQ,20 BGA8,2X4,16
Package shape - RECTANGULAR SQUARE RECTANGULAR
Package form - SMALL OUTLINE, HEAT SINK/SLUG CHIP CARRIER, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing - TR TR TR
Peak Reflow Temperature (Celsius) - 260 260 260
power supply - 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Maximum supply current (ICC) - 0.01 mA 0.0009 mA 0.0009 mA
Prop。Delay @ Nom-Su - 19.3 ns 19.3 ns 19.3 ns
propagation delay (tpd) - 19.3 ns 19.3 ns 19.3 ns
Certification status - Not Qualified Not Qualified Not Qualified
Schmitt trigger - NO NO NO
Maximum seat height - 0.4 mm 0.6 mm 0.5 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) - 1.2 V 1.2 V 1.2 V
surface mount - YES YES YES
technology - CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form - NO LEAD NO LEAD BALL
Terminal pitch - 0.35 mm 0.5 mm 0.4 mm
Terminal location - DUAL QUAD BOTTOM
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
translate - N/A N/A N/A
width - 1 mm 1.5 mm 0.77 mm

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