|
SN74AUP3G06RSER |
SN74AUP3G06DQER |
SN74AUP3G06DCUR |
SN74AUP3G06YFPR |
| Description |
Low-Power Triple Inverter Buffer/Driver With Open-Drain Outputs 8-UQFN -40 to 85 |
Low-Power Triple Inverter Buffer/Driver With Open-Drain Outputs 8-X2SON -40 to 85 |
Buffer/Driver 3-CH Inverting Open Drain CMOS 8-Pin VSSOP T/R |
Low-Power Triple Inverter Buffer/Driver With Open-Drain Outputs 8-DSBGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
- |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
- |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
- |
conform to |
| Parts packaging code |
QFN |
QFN |
- |
BGA |
| package instruction |
VQCCN, LCC8,.06SQ,20 |
HSON, SOLCC8,.04,14 |
- |
VFBGA, BGA8,2X4,16 |
| Contacts |
8 |
8 |
- |
8 |
| Reach Compliance Code |
compli |
compli |
- |
compli |
| ECCN code |
EAR99 |
EAR99 |
- |
EAR99 |
| Counting direction |
UNIDIRECTIONAL |
UNIDIRECTIONAL |
- |
UNIDIRECTIONAL |
| series |
AUP/ULP/V |
AUP/ULP/V |
- |
AUP/ULP/V |
| JESD-30 code |
S-PQCC-N8 |
R-PDSO-N8 |
- |
R-XBGA-B8 |
| JESD-609 code |
e4 |
e4 |
- |
e1 |
| length |
1.5 mm |
1.4 mm |
- |
1.57 mm |
| Load capacitance (CL) |
30 pF |
30 pF |
- |
30 pF |
| Logic integrated circuit type |
BUS DRIVER |
BUS DRIVER |
- |
BUS DRIVER |
| MaximumI(ol) |
0.004 A |
0.004 A |
- |
0.004 A |
| Humidity sensitivity level |
1 |
1 |
- |
1 |
| Number of digits |
1 |
1 |
- |
1 |
| Number of functions |
3 |
3 |
- |
3 |
| Number of ports |
2 |
2 |
- |
2 |
| Number of terminals |
8 |
8 |
- |
8 |
| Maximum operating temperature |
85 °C |
85 °C |
- |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
- |
-40 °C |
| Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
- |
OPEN-DRAIN |
| Output polarity |
INVERTED |
INVERTED |
- |
INVERTED |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
UNSPECIFIED |
| encapsulated code |
VQCCN |
HSON |
- |
VFBGA |
| Encapsulate equivalent code |
LCC8,.06SQ,20 |
SOLCC8,.04,14 |
- |
BGA8,2X4,16 |
| Package shape |
SQUARE |
RECTANGULAR |
- |
RECTANGULAR |
| Package form |
CHIP CARRIER, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG |
- |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing |
TR |
TR |
- |
TR |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
- |
260 |
| power supply |
1.2/3.3 V |
1.2/3.3 V |
- |
1.2/3.3 V |
| Maximum supply current (ICC) |
0.0009 mA |
0.01 mA |
- |
0.0009 mA |
| Prop。Delay @ Nom-Su |
19.3 ns |
19.3 ns |
- |
19.3 ns |
| propagation delay (tpd) |
19.3 ns |
19.3 ns |
- |
19.3 ns |
| Certification status |
Not Qualified |
Not Qualified |
- |
Not Qualified |
| Schmitt trigger |
NO |
NO |
- |
NO |
| Maximum seat height |
0.6 mm |
0.4 mm |
- |
0.5 mm |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
- |
3.6 V |
| Minimum supply voltage (Vsup) |
0.8 V |
0.8 V |
- |
0.8 V |
| Nominal supply voltage (Vsup) |
1.2 V |
1.2 V |
- |
1.2 V |
| surface mount |
YES |
YES |
- |
YES |
| technology |
CMOS |
CMOS |
- |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
| Terminal surface |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
NO LEAD |
NO LEAD |
- |
BALL |
| Terminal pitch |
0.5 mm |
0.35 mm |
- |
0.4 mm |
| Terminal location |
QUAD |
DUAL |
- |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| translate |
N/A |
N/A |
- |
N/A |
| width |
1.5 mm |
1 mm |
- |
0.77 mm |