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IS42S86400B-6TL

Description
Synchronous DRAM, 64MX8, 6ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, TSOP2-54
Categorystorage    storage   
File Size953KB,62 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance
Download Datasheet Parametric View All

IS42S86400B-6TL Overview

Synchronous DRAM, 64MX8, 6ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, TSOP2-54

IS42S86400B-6TL Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP2
package instructionTSOP2, TSOP54,.46,32
Contacts54
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)166 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PDSO-G54
JESD-609 codee3
length22.22 mm
memory density536870912 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals54
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP54,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height1.2 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.004 A
Maximum slew rate0.35 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
width10.16 mm
IS42S86400B
IS42S16320B, IS45S16320B
64M x 8, 32M x 16
512Mb SYNCHRONOUS DRAM
FEATURES
• Clock frequency: 166, 143, 133 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
V
dd
V
ddq
IS42/45S16320B 3.3V 3.3V
IS42S86400B
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh
• 8K refresh cycles every 16ms (A2 grade) or
64 ms (Commercial, Industrial, A1 grade)
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Available in 54-pin TSOP-II and 54-ball W-BGA
(x16 only)
• Operating Temperature Range:
Commercial: 0
o
C to +70
o
C
Industrial: -40
o
C to +85
o
C
Automotive, A1: -40
o
C to +85
o
C
Automotive, A2: -40
o
C to +105
o
C
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such ap-
plications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
DECEMBER 2011
OVERVIEW
ISSI
's 512Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
The 512Mb SDRAM is organized as follows.
IS42S86400B
16Mx8x4 Banks
54-pin TSOPII
IS42/45S16320B
8M x16x4 Banks
54-pin TSOPII
54-ball W-BGA
3.3V 3.3V
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
Clk Frequency
CAS Latency = 3
CAS Latency = 2
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
-6
6
10
166
100
5.4
6
-7
7
10
143
100
5.4
6
-75E
7.5
133
5.5
Unit
ns
ns
Mhz
Mhz
ns
ns
Integrated Silicon Solution, Inc. — www.issi.com
Rev. H
12/01/2011
1
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