K9F6408Q0C-BCB0,K9F6408Q0C-BIB0
K9F6408U0C-TCB0,K9F6408U0C-TIB0
K9F6408U0C-BCB0,K9F6408U0C-BIB0
K9F6408U0C-VCB0,K9F6408U0C-VIB0
FLASH MEMORY
Document Title
8M x 8 Bit NAND Flash Memory
Revision History
Revision No. History
0.0
0.1
Initial issue.
1. I
OL
(R/B) of 1.8V device is changed.
-min. Value: 7mA -->3mA
-typ. Value: 8mA -->4mA
2. Package part number is modified.
K9F6408U0C-Y ---> K9F6408U0C_T
3. AC parameter is changed.
tRP(min.) : 30ns --> 25ns
0.2
1. TBGA package is changed.
- 9mmX11mm 63ball TBGA ---> 6mmX8.5mm 48ball TBGA
2. Part number(TBGA package part number) is changed
- K9F6408Q0C-D ----> K9F6408Q0C-B
- K9F6408U0C-D -----> K9F6408U0C-B
3. K9F6408U0C-BCB0,BIB0 products are added
0.3
1. WSOP1 package is added.
- Part number : K9F6408U0C_VCB0,VIBO
Nov. 12 . 2001
Draft Date
Jul. 24 . 2001
Nov. 5 . 2001
Remark
Advance
Preliminary
Mar. 13 . 2002
Note : For more detailed features and specifications including FAQ, please refer to Samsung’ Flash web site.
s
http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the
SAMSUNG branch office near you.
1
K9F6408Q0C-BCB0,K9F6408Q0C-BIB0
K9F6408U0C-TCB0,K9F6408U0C-TIB0
K9F6408U0C-BCB0,K9F6408U0C-BIB0
K9F6408U0C-VCB0,K9F6408U0C-VIB0
FLASH MEMORY
8M x 8 Bit Bit NAND Flash Memory
PRODUCT LIST
Part Number
K9F6408Q0C-B
K9F6408U0C-B
K9F6408U0C-T
K9F6408U0C-V
2.7 ~ 3.6V
Vcc Range
1.65 ~ 1.95V
X8
TSOP II
WSOP I
Organization
PKG Type
TBGA
FEATURES
•
Voltage Supply
- 1.8V device(K9F6408Q0C) : 1.65~1.95V
- 3.3V device(K9F6408U0C) : 2.7 ~ 3.6 V
•
Organization
- Memory Cell Array : (8M + 256K)bit x 8bit
- Data Register
: (512 + 16)bit x8bit
•
Automatic Program and Erase
- Page Program : (512 + 16)Byte
- Block Erase : (8K + 256)Byte
•
528-Byte Page Read Operation
- Random Access : 10µs(Max.)
- Serial Page Access
- 1.8V device(K9F6408Q0C) : 50ns
- 3.3V device(K9F6408U0C) : 50ns
•
Fast Write Cycle Time
- Program Time
- 1.8V device(K9F6408Q0C) : 200µs(Typ.)
- 3.3V device(K9F6408U0C) : 200µs(Typ.)
- Block Erase Time : 2ms(Typ.)
•
Command/Address/Data Multiplexed I/O Port
•
Hardware Data Protection
- Program/Erase Lockout During Power Transitions
•
Reliable CMOS Floating-Gate Technology
- Endurance : 100K Program/Erase Cycles
- Data Retention : 10 Years
•
Command Register Operation
•
Package
- K9F6408U0C-TCB0/TIB0 :
44(40) - Lead TSOP Type II (400mil / 0.8 mm pitch)
- K9F6408Q0C-BCB0/BIB0
48- Ball TBGA ( 6 x 8.5 /0.8mm pitch , Width 1.0 mm)
- K9F6408U0C-VCB0/VIB0
48 - Pin WSOP I (12X17X0.7mm)
* K9F6408U0C-V(WSOPI ) is the same device as
K9F6408U0C-T(TSOPII) except package type.
GENERAL DESCRIPTION
The K9F6408X0C is a 8M(8,388,608)x8bit NAND Flash Memory with a spare 256K(262,144)x8bit. The device is offered in 1.8V or
3.3V Vcc. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. A program operation pro-
grams the 528-byte page in typical 200µs and an erase operation can be performed in typical 2ms on an 8K-byte block. Data in the
page can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as com-
mand inputs. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and
internal verification and margining of data. Even the write-intensive systems can take advantage of the K9F6408X0C′s extended reli-
ability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. These algo-
rithms have been implemented in many mass storage applications and also the spare 16 bytes of a page combined with the other
512 bytes can be utilized by system-level ECC.
The K9F6408X0C is an optimum solution for large nonvolatile storage applications such as solid state file storage, digital voice
recorder, digital still camera and other portable applications requiring non-volatility.
2
K9F6408Q0C-BCB0,K9F6408Q0C-BIB0
K9F6408U0C-TCB0,K9F6408U0C-TIB0
K9F6408U0C-BCB0,K9F6408U0C-BIB0
K9F6408U0C-VCB0,K9F6408U0C-VIB0
FLASH MEMORY
PIN CONFIGURATION (TSOP II )
K9F6408U0C-TCB0/TIB0
V
SS
CLE
ALE
WE
WP
N.C
N.C
N.C
N.C
N.C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
V
CC
CE
RE
R/B
GND
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
I/O0
I/O1
I/O2
I/O3
V
SS
N.C
N.C
N.C
N.C
N.C
I/O7
I/O6
I/O5
I/O4
V
CC
PACKAGE DIMENSIONS
44(40) LEAD PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(II)
44(40) - TSOP II - 400F
0~8°
0.25
0.010 TYP
#44(40)
#23(21)
0.45~0.75
0.018~0.030
11.76
±0.20
0.463
±0.008
10.16
0.400
0.50
0.020
#1
#22(20)
+0.10
Unit :mm/Inch
0.15
-0.05
18.81
Max.
0.741
18.41
±0.10
0.725
±0.004
1.00
±0.10
0.039
±0.004
0.006
-0.002
1.20
Max.
0.047
+0.004
0.10
MAX
0.004
0.05
Min.
0.002
(
0.805
)
0.032
0.35
±0.10
0.014
±0.004
0.80
0.0315
3
K9F6408Q0C-BCB0,K9F6408Q0C-BIB0
K9F6408U0C-TCB0,K9F6408U0C-TIB0
K9F6408U0C-BCB0,K9F6408U0C-BIB0
K9F6408U0C-VCB0,K9F6408U0C-VIB0
FLASH MEMORY
PIN CONFIGURATION (TBGA)
K9F6408X0C-BCB0/BIB0
1
2
3
4
5
6
A
WP
N.C
N.C
N.C
N.C
N.C
N.C
V
SS
ALE
RE
N.C
N.C
N.C
I/O
0
I/O
1
I/O
2
N.C
CLE
N.C
N.C
N.C
N.C
N.C
I/O
3
CE
N.C
N.C
N.C
N.C
N.C
V
CC
Q
I/O
4
WE
N.C
N.C
N.C
N.C
N.C
I/O
5
I/O
6
R/B
N.C
N.C
N.C
N.C
V
CC
I/O
7
V
SS
B
C
D
E
F
G
H
(Top View)
PACKAGE DIMENSIONS
48-Ball TBGA (measured in millimeters)
Top View
Bottom View
6.00
±0.10
0.80 x5= 4.00
6.00
±0.10
0.80
(Datum A)
A
6
A
5
4
3
2
1
Ball #A1
(Datum B)
B
0.80
C
D
E
2.80
F
G
H
0.80 x7= 5.60
8.50
±0.10
48-∅0.45
±0.05
∅
0.20
M
A B
2.00
Side View
0.90
±0.10
0.32
±0.05
0.45
±0.05
0.08MAX
6.00
±0.10
4
8.50
±0.10
B
K9F6408Q0C-BCB0,K9F6408Q0C-BIB0
K9F6408U0C-TCB0,K9F6408U0C-TIB0
K9F6408U0C-BCB0,K9F6408U0C-BIB0
K9F6408U0C-VCB0,K9F6408U0C-VIB0
FLASH MEMORY
PIN CONFIGURATION (WSOP1)
K9F6408U0C-VCB0/VIB0
N.C
N.C
DNU
N.C
N.C
N.C
R/B
RE
CE
DNU
N.C
Vcc
Vss
N.C
DNU
CLE
ALE
WE
WP
N.C
N.C
DNU
N.C
N.C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
N.C
N.C
DNU
N.C
I/O7
I/O6
I/O5
I/O4
N.C
DNU
N.C
Vcc
Vss
N.C
DNU
N.C
I/O3
I/O2
I/O1
I/O0
N.C
DNU
N.C
N.C
PACKAGE DIMENSIONS
48-PIN LEAD PLASTIC VERY VERY THIN SMALL OUT-LINE PACKAGE TYPE (I)
48 - WSOP1 - 1217F
Unit :mm
0.70 MAX
15.40
±0.10
0.58
±0.04
#1
+0.07
-0.03
#48
+0.07
-0.03
0.16
12.00
±0.10
0.50TYP
(0.50
±
0.06)
0.20
#24
#25
0~0.08
(0.1Max)
0.10
+0.075
-0.035
0
°
~
8
°
0.45~0.75
17.00
±0.20
5
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