MCM94256S70 datasheet, PDF - EEWORLD Datasheet

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MCM94256S70: Description256KX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30; Categorystorage storage; File Size382KB，12 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MCM94256S70 Overview

256KX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30

MCM94256S70 Parametric

Parameter Name	Attribute value
Maker	Motorola ( NXP )
Parts packaging code	SIMM
package instruction	, SIP30,.2
Contacts	30
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	70 ns
Other features	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 code	R-XSMA-N30
JESD-609 code	e0
memory density	2359296 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	9
Number of functions	1
Number of ports	1
Number of terminals	30
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX9
Output characteristics	3-STATE
Package body material	UNSPECIFIED
Encapsulate equivalent code	SIP30,.2
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
Maximum seat height	14.097 mm
Maximum standby current	0.003 A
Maximum slew rate	0.225 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	2.54 mm
Terminal location	SINGLE

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MCM94256S70 Related Products

	MCM94256S70	MCM94256S80
Description	256KX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30	256KX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30
Maker	Motorola ( NXP )	Motorola ( NXP )
Parts packaging code	SIMM	SIMM
package instruction	, SIP30,.2	, SIP30,.2
Contacts	30	30
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE
Maximum access time	70 ns	80 ns
Other features	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 code	R-XSMA-N30	R-XSMA-N30
JESD-609 code	e0	e0
memory density	2359296 bit	2359296 bit
Memory IC Type	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
memory width	9	9
Number of functions	1	1
Number of ports	1	1
Number of terminals	30	30
word count	262144 words	262144 words
character code	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	256KX9	256KX9
Output characteristics	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED
Encapsulate equivalent code	SIP30,.2	SIP30,.2
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
refresh cycle	512	512
Maximum seat height	14.097 mm	14.097 mm
Maximum standby current	0.003 A	0.003 A
Maximum slew rate	0.225 mA	0.21 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD
Terminal pitch	2.54 mm	2.54 mm
Terminal location	SINGLE	SINGLE

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