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MCM94256S80

Description
256KX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30
Categorystorage    storage   
File Size382KB,12 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MCM94256S80 Overview

256KX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30

MCM94256S80 Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeSIMM
package instruction, SIP30,.2
Contacts30
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time80 ns
Other featuresRAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 codeR-XSMA-N30
JESD-609 codee0
memory density2359296 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width9
Number of functions1
Number of ports1
Number of terminals30
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX9
Output characteristics3-STATE
Package body materialUNSPECIFIED
Encapsulate equivalent codeSIP30,.2
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum seat height14.097 mm
Maximum standby current0.003 A
Maximum slew rate0.21 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch2.54 mm
Terminal locationSINGLE

MCM94256S80 Related Products

MCM94256S80 MCM94256S70
Description 256KX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 256KX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30
Maker Motorola ( NXP ) Motorola ( NXP )
Parts packaging code SIMM SIMM
package instruction , SIP30,.2 , SIP30,.2
Contacts 30 30
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode FAST PAGE FAST PAGE
Maximum access time 80 ns 70 ns
Other features RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 code R-XSMA-N30 R-XSMA-N30
JESD-609 code e0 e0
memory density 2359296 bit 2359296 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 9 9
Number of functions 1 1
Number of ports 1 1
Number of terminals 30 30
word count 262144 words 262144 words
character code 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 256KX9 256KX9
Output characteristics 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED
Encapsulate equivalent code SIP30,.2 SIP30,.2
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
refresh cycle 512 512
Maximum seat height 14.097 mm 14.097 mm
Maximum standby current 0.003 A 0.003 A
Maximum slew rate 0.21 mA 0.225 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD
Terminal pitch 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE
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