8K ROM Z8 CMOS MICROCONTROLLER

| Z86C21 | Z86C2116PSC | Z86C2116VSC | Z86C2112VSC | Z86C2116FSC | Z86C2112PSC | Z86C2112VEC | Z86C2112FSC | Z86C2112PEC | Z86C2112FEC | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | - | Zilog, Inc. | - | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. |
| Parts packaging code | - | DIP | LCC | LCC | QFP | DIP | LCC | QFP | DIP | QFP |
| package instruction | - | PLASTIC, DIP-40 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | PLASTIC, QFP-44 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.57SQ,32 | DIP, DIP40,.6 | QFP, QFP44,.57SQ,32 |
| Contacts | - | 40 | 44 | 44 | 44 | 40 | 44 | 44 | 40 | 44 |
| Reach Compliance Code | - | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Has ADC | - | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Other features | - | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES |
| Address bus width | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| bit size | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| boundary scan | - | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| CPU series | - | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 |
| maximum clock frequency | - | 16 MHz | 16 MHz | 12 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| DAC channel | - | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA channel | - | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| External data bus width | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Format | - | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | - | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | - | R-PDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 | R-PDIP-T40 | S-PQFP-G44 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | - | 52.325 mm | 16.5862 mm | 16.5862 mm | 10 mm | 52.325 mm | 16.5862 mm | 10 mm | 52.325 mm | 10 mm |
| low power mode | - | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| Number of external interrupt devices | - | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of I/O lines | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of serial I/Os | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | - | 40 | 44 | 44 | 44 | 40 | 44 | 44 | 40 | 44 |
| Number of timers | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| On-chip data RAM width | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| On-chip program ROM width | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 105 °C | 70 °C | 105 °C | 105 °C |
| PWM channel | - | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | DIP | QCCJ | QCCJ | QFP | DIP | QCCJ | QFP | DIP | QFP |
| Encapsulate equivalent code | - | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | QFP44,.57SQ,32 | DIP40,.6 | LDCC44,.7SQ | QFP44,.57SQ,32 | DIP40,.6 | QFP44,.57SQ,32 |
| Package shape | - | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| Package form | - | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK |
| Peak Reflow Temperature (Celsius) | - | 240 | 225 | 225 | 240 | NOT SPECIFIED | 240 | 240 | 240 | 240 |
| power supply | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | - | 236 | 236 | 236 | 236 | 236 | 236 | 236 | 236 | 236 |
| RAM (number of words) | - | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| rom(word) | - | 8192 | 8192 | 8192 | 8192 | 8192 | 8000 | 8000 | 8000 | 8000 |
| ROM programmability | - | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| Maximum seat height | - | 4.96 mm | 4.57 mm | 4.57 mm | 2.5 mm | 4.24 mm | 4.57 mm | 2.5 mm | 4.96 mm | 2.5 mm |
| speed | - | 16 MHz | 16 MHz | 12 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| Maximum slew rate | - | 35 mA | 35 mA | 30 mA | 35 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA |
| Maximum supply voltage | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | NO | YES | YES | YES | NO | YES | YES | NO | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | THROUGH-HOLE | J BEND | J BEND | GULL WING | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE | GULL WING |
| Terminal pitch | - | 2.54 mm | 1.27 mm | 1.27 mm | 0.8 mm | 2.54 mm | 1.27 mm | 0.8 mm | 2.54 mm | 0.8 mm |
| Terminal location | - | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | 15.24 mm | 16.5862 mm | 16.5862 mm | 10 mm | 15.24 mm | 16.5862 mm | 10 mm | 15.24 mm | 10 mm |
| uPs/uCs/peripheral integrated circuit type | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |