IS27HC512-55TI datasheet, PDF - EEWORLD Datasheet

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IS27HC512-55TI: DescriptionOTP ROM, 64KX8, 55ns, CMOS, PDSO28, TSOP-28; Categorystorage storage; File Size473KB，11 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS27HC512-55TI Overview

OTP ROM, 64KX8, 55ns, CMOS, PDSO28, TSOP-28

IS27HC512-55TI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	TSOP
package instruction	TSOP-28
Contacts	28
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G28
JESD-609 code	e0
length	11.8 mm
memory density	524288 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP28,.53,22
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.55 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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IS27HC512-55TI Related Products

	IS27HC512-55TI	IS27HC512-45T	IS27HC512-45TI	IS27HC512-70TI	IS27HC512-55PLI	IS27HC512-45PLI	IS27HC512-55PL	IS27HC512-70T
Description	OTP ROM, 64KX8, 55ns, CMOS, PDSO28, TSOP-28	OTP ROM, 64KX8, 45ns, CMOS, PDSO28, TSOP-28	OTP ROM, 64KX8, 45ns, CMOS, PDSO28, TSOP-28	OTP ROM, 64KX8, 70ns, CMOS, PDSO28, TSOP-28	OTP ROM, 64KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 64KX8, 45ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 64KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 64KX8, 70ns, CMOS, PDSO28, TSOP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	TSOP	TSOP	TSOP	TSOP	QFJ	QFJ	QFJ	TSOP
package instruction	TSOP-28	TSOP-28	TSOP-28	TSOP-28	PLASTIC, LCC-32	PLASTIC, LCC-32	PLASTIC, LCC-32	TSOP-28
Contacts	28	28	28	28	32	32	32	28
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	45 ns	45 ns	70 ns	55 ns	45 ns	55 ns	70 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PQCC-J32	R-PQCC-J32	R-PQCC-J32	R-PDSO-G28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	11.8 mm	11.8 mm	11.8 mm	11.8 mm	13.97 mm	13.97 mm	13.97 mm	11.8 mm
memory density	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	32	32	32	28
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	85 °C	85 °C	85 °C	70 °C	70 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-	-
organize	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP1	TSOP1	TSOP1	QCCJ	QCCJ	QCCJ	TSOP1
Encapsulate equivalent code	TSSOP28,.53,22	TSSOP28,.53,22	TSSOP28,.53,22	TSSOP28,.53,22	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	TSSOP28,.53,22
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	3.55 mm	3.55 mm	3.55 mm	1.2 mm
Maximum standby current	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	J BEND	J BEND	J BEND	GULL WING
Terminal pitch	0.55 mm	0.55 mm	0.55 mm	0.55 mm	1.27 mm	1.27 mm	1.27 mm	0.55 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	8 mm	8 mm	8 mm	11.43 mm	11.43 mm	11.43 mm	8 mm
Maker	Integrated Silicon Solution ( ISSI )	-	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )

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