OTP ROM, 64KX8, 45ns, CMOS, PDSO28, TSOP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | TSOP |
| package instruction | TSOP-28 |
| Contacts | 28 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum access time | 45 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e0 |
| length | 11.8 mm |
| memory density | 524288 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 64KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP1 |
| Encapsulate equivalent code | TSSOP28,.53,22 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum standby current | 0.001 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.55 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8 mm |
| Base Number Matches | 1 |
| IS27HC512-45TI | IS27HC512-45T | IS27HC512-55TI | IS27HC512-70TI | IS27HC512-55PLI | IS27HC512-45PLI | IS27HC512-55PL | IS27HC512-70T | |
|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 64KX8, 45ns, CMOS, PDSO28, TSOP-28 | OTP ROM, 64KX8, 45ns, CMOS, PDSO28, TSOP-28 | OTP ROM, 64KX8, 55ns, CMOS, PDSO28, TSOP-28 | OTP ROM, 64KX8, 70ns, CMOS, PDSO28, TSOP-28 | OTP ROM, 64KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 64KX8, 45ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 64KX8, 55ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 64KX8, 70ns, CMOS, PDSO28, TSOP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | TSOP | TSOP | TSOP | TSOP | QFJ | QFJ | QFJ | TSOP |
| package instruction | TSOP-28 | TSOP-28 | TSOP-28 | TSOP-28 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | TSOP-28 |
| Contacts | 28 | 28 | 28 | 28 | 32 | 32 | 32 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 45 ns | 45 ns | 55 ns | 70 ns | 55 ns | 45 ns | 55 ns | 70 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PDSO-G28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm | 13.97 mm | 13.97 mm | 13.97 mm | 11.8 mm |
| memory density | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 32 | 32 | 32 | 28 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
| organize | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP1 | TSOP1 | TSOP1 | TSOP1 | QCCJ | QCCJ | QCCJ | TSOP1 |
| Encapsulate equivalent code | TSSOP28,.53,22 | TSSOP28,.53,22 | TSSOP28,.53,22 | TSSOP28,.53,22 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | TSSOP28,.53,22 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.55 mm | 3.55 mm | 3.55 mm | 1.2 mm |
| Maximum standby current | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND | GULL WING |
| Terminal pitch | 0.55 mm | 0.55 mm | 0.55 mm | 0.55 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.55 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 8 mm | 8 mm | 8 mm | 8 mm | 11.43 mm | 11.43 mm | 11.43 mm | 8 mm |
| Maker | - | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
RF/Wirelessly
51mcu
stm32/stm8
Power technology
MCU
ARM Technology
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