MCP1790/MCP1791
70 mA, High Voltage Regulator
Features
• 48V (43.5V ±10%) load dump protected for <500 ms
with a 30 second repetition rate (FORD Test Pulse
G Loaded)
• Wide steady state supply voltage, 6.0V - 30.0V
• Extended Junction Temperature Range:
-40 to +125°C
• Fixed output voltages: 3.0V, 3.3V, 5.0V
• Low quiescent current: 70 µA typical
• Low shutdown quiescent current: 10 µA typical
• Output Voltage Tolerances of ±2.5% over the
temperature range
• Maximum output current of 70 mA @ +125°C
Junction Temperature
• Maximum continuous input voltage of 30V
• Internal thermal overload protection, +157°C
(typical) Junction Temperature
• Internal short circuit current limit, 120 mA (typical)
for +5V option
• Short Circuit Current Foldback
• Shutdown Input option (MCP1791)
• Power Good Output option (MCP1791)
• High PSRR, -90 dB@100 Hz (typical)
• Stable with 1 µF to 1000 µF Tantalum and
Electrolytic Capacitors
• Stable with 4.7 µF to 1000 µF Ceramic Capacitors
General Description
The MCP1790/MCP1791 regulator provides up to 70 mA
of current. The input operating voltage range is specified
from 6.0V to 30V continuous, 48V absolute max, making
it ideal for automotive and commercial 12/24 VDC
systems.
The MCP1790/MCP1791 has a tight tolerance output
voltage load regulation of ±0.2% (typical) and a very
good line regulation at ±0.0002%/V (typical). The
regulator output is stable with ceramic, tantalum and
electrolytic capacitors. The MCP1790/MCP1791
regulator incorporates both thermal and short circuit
protection.
The MCP1790 is the 3-pin version of the MCP1790/
MCP1791 family. The MCP1791 is the 5-pin version
and incorporates a Shutdown input signal and a Power
Good output signal.
The regulator is specifically designed to operate in the
automotive environment and will survive +48V (43.5V
±10%) load dump transients and double-battery jumps.
The device is designed to meet the stringent quiescent
current requirements of the automotive industry. The
device is also designed for the commercial low voltage
fire alarm/detector systems, which use 24 VDC to
supply the required alarms throughout buildings. The
low ground current, 110 µA (typ.), of the CMOS device
will provide a power cost savings to the end users over
similar bipolar devices. Typical buildings using
hundreds of 24V powered fire and smoke detectors can
see substantial savings on energy consumption and
wiring gage reduction compared to bipolar regulators.
The MCP1790 device will be offered in the 3-pin
DD-PAK, and SOT-223 packages.
The MCP1791 device will be offered in the 5-pin
DD-PAK, and SOT-223 packages.
The MCP1790/MCP1791 will have a junction
temperature operating range of -40°C to +125°C.
Applications
• Low Voltage A/C powered (24VAC) Fire Alarms,
CO
2
Sensors, HVAC Controls
• Automotive Electronics
• Automotive Accessory Power Adapters
• Electronic Thermostat Controls
• Microcontroller power
©
2010 Microchip Technology Inc.
DS22075B-page 1
MCP1790/MCP1791
Package Types
MCP1790
DDPAK-3
SOT-223-3
4
MCP1791
DDPAK-5
SOT-223-5
6
1
2
3
1
2
3
1 2 3 4 5
1
2
3
4
5
Pin
1
2
3
4
V
IN
GND (TAB)
V
OUT
GND (TAB)
Pin
1
2
3
4
5
6
SHDN
V
IN
GND (TAB)
V
OUT
PWRGD
GND (TAB)
DS22075B-page 2
©
2010 Microchip Technology Inc.
MCP1790/MCP1791
TYPICAL APPLICATION
MCP1791
R
1
100 kΩ
SHDN
V
IN
= 6V to 30V
C
1
4.7 µF
V
IN
1
GND
V
OUT
PWRGD
On
Off
V
OUT
= 5.0V @ 70 mA
C
2
1 µF Tantalum
MCP1790
1
V
IN
= 8.0V to 16V
5Ω
V
IN
C
1
1.0 µF
GND
V
OUT
V
OUT
= 3.3V @ 70 mA
C
2
1.0 µF Tantalum
©
2010 Microchip Technology Inc.
DS22075B-page 3
MCP1790/MCP1791
1.0
ELECTRICAL
CHARACTERISTICS
† Notice:
Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings †
Input Voltage,
V
IN
........................................................+48.0V
V
IN
, PWRGD, SHDN ..................... (GND-0.3V) to (
V
IN
+0.3V)
V
OUT
.................................................... (GND-0.3V) to (+5.5V)
Internal Power Dissipation ............ Internally-Limited
(Note 4)
Output Short Circuit Current..................................Continuous
Storage temperature .....................................-55°C to +150°C
Maximum Junction Temperature .....................165°C
(Note 7)
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins........
≥ 6
kV HBM and
≥
400V MM
AC/DC CHARACTERISTICS
Electrical Specifications:
Unless otherwise noted, V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX),
(Note 1),
I
OUT
= 1 mA,
C
OUT
= 4.7 µF (X7R Ceramic), C
IN
= 4.7 µF (X7R Ceramic), T
A
= +25°C, SHDN > 2.4V.
Boldface
type applies for junction temperatures, T
J
(Note 5)
of
-40°C to +125°C.
Parameters
Input Operating Voltage
Input Quiescent Current
Input Quiescent Current for SHDN
Mode
Ground Current
Maximum Output Current
Line Regulation
Load Regulation
Output Peak Short Circuit Current
Output Voltage Regulation
V
OUT
Temperature Coefficient
Input Voltage to Turn On Output
Note 1:
2:
3:
4:
Symbol
V
IN
I
q
I
SHDN
I
GND
I
OUT
ΔV
OUT
/
(V
OUT
XΔV
IN
)
ΔV
OUT
/V
OUT
I
OUT_SC
V
OUT
TCV
OUT
V
ON
Min
6.0
—
—
—
70
—
-0.45
—
V
R
-2.5%
—
—
Typ
—
70
10
110
—
±0.0002
±0.2
V
R
/10
V
R
65
5.5
Max
30.0
130
25
210
—
±0.05
0.45
—
V
R
+2.5%
—
6.0
Units
V
µA
µA
µA
mA
%/V
%
A
V
ppm/°C
V
6.0V < V
IN
< 30V
I
OUT
= 1 mA to 70 mA
(Note 3)
R
LOAD
< 0.1Ω,
Peak Current
—
Note 9
Rising V
IN
Conditions
+48
V
DC
Load Dump Peak
< 500 ms
I
L
= 0 mA
SHDN = GND
I
L
= 70 mA
5:
6:
7:
8:
9:
The minimum V
IN
, V
IN(MIN)
must meet two conditions: V
IN
≥ 6.0V
and V
IN
≥
V
OUT(MAX)
+
V
DROPOUT(MAX).
V
R
is the nominal regulator output voltage.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 165°C rating. Sustained
junction temperatures above 165°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
IN
= V
R
+ V
DROPOUT(MAX)
.
Sustained junction temperatures above 165°C can impact the device reliability.
The Short Circuit Recovery Time test is done by placing the device into a short circuit condition and then removing the
short circuit condition before the device die temperature reaches 125 °C. If the device goes into thermal shutdown, then
the Short Circuit Recovery Time will depend upon the thermal dissipation properties of the package and circuit board.
TCV
OUT
= (V
OUT-HIGH
- V
OUT-LOW
) *10^6/(V
R
*
ΔTemperature),
V
OUT-HIGH
= highest voltage measured over the temperature
range. V
OUT-LOW
= lowest voltage measured over the temperature range.
DS22075B-page 4
©
2010 Microchip Technology Inc.
MCP1790/MCP1791
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications:
Unless otherwise noted, V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX),
(Note 1),
I
OUT
= 1 mA,
C
OUT
= 4.7 µF (X7R Ceramic), C
IN
= 4.7 µF (X7R Ceramic), T
A
= +25°C, SHDN > 2.4V.
Boldface
type applies for junction temperatures, T
J
(Note 5)
of
-40°C to +125°C.
Parameters
Short Circuit Foldback Voltage Corner
Symbol
V
FOLDBACK
Min
—
—
—
Short Circuit Foldback Current
—
Typ
4.2
3.0
2.7
105
Max
—
—
—
—
Units
V
V
V
mA
Conditions
V
R
= 5.0V
Falling V
OUT,
R
LOAD
< 0.1Ω
V
R
= 3.3V
Falling V
OUT,
R
LOAD
< 0.1Ω
V
R
= 3.0V
Falling V
OUT,
R
LOAD
< 0.1Ω
V
OUT
~= 0V,
R
LOAD
< 0.1Ω,
V
R
= 5.0V
(Note 2)
V
R
= 3.3V
(Note 2)
V
R
= 3.0V
(Note 2)
V
IN
= 0V to 6.0V
I
OUT
= 70 mA,
(Note 6)
V
R
= 5.0V, V
IN
= 4.500V
V
R
= 3.3V, V
IN
= 4.500V
V
R
= 3.0V, V
IN
= 4.500V
—
—
SHDN = GND
SHDN = 6V
—
Falling Edge of V
OUT
Rising Edge of V
OUT
I
PWRGD SINK
= 5.0 mA,
V
OUT
= 0V
V
PWRGD
<= 0.4V
V
PWRGD
= V
IN
= 6.0V
Rising Edge
—
—
Startup Voltage Overshoot
Dropout Voltage
Dropout Current
I
OUT
= 0 mA
Shutdown Input
Logic High Input
Logic Low Input
Shutdown Input Leakage Current
Power Good Characteristics
PWRGD Input Voltage Operating
Range
PWRGD Threshold Voltage
(Referenced to V
OUT
)
PWRGD Threshold Hysteresis
PWRGD Output Voltage LOW
PWRGD Output Sink Current
PWRGD Leakage
PWRGD Time Delay
Note 1:
2:
3:
4:
V
PWRGD_VIN
V
PWRGD_TH
V
PWRGD_HYS
V
PWRGD_L
I
PWRGD_L
I
PWRGD
_
LK
T
PG
2.8
88
1.0
—
5.0
—
—
V
SHDN-HIGH
V
SHDN-LOW
SHDN
ILK
2.4
0
—
—
V
OVER
V
DROPOUT
I
DO
—
—
—
—
—
99
99
0.10
700
130
75
75
—
—
0.100
3.0
—
90
2.0
0.2
—
1.0
30
—
—
—
1300
—
—
—
V
IN(MAX)
0.8
0.500
5.0
—
92
3.0
0.4
—
—
—
mA
mA
% V
OUT
mV
µA
µA
µA
V
V
µA
V
%V
OUT
%V
OUT
V
mA
nA
µs
5:
6:
7:
8:
9:
The minimum V
IN
, V
IN(MIN)
must meet two conditions: V
IN
≥ 6.0V
and V
IN
≥
V
OUT(MAX)
+
V
DROPOUT(MAX).
V
R
is the nominal regulator output voltage.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 165°C rating. Sustained
junction temperatures above 165°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
IN
= V
R
+ V
DROPOUT(MAX)
.
Sustained junction temperatures above 165°C can impact the device reliability.
The Short Circuit Recovery Time test is done by placing the device into a short circuit condition and then removing the
short circuit condition before the device die temperature reaches 125 °C. If the device goes into thermal shutdown, then
the Short Circuit Recovery Time will depend upon the thermal dissipation properties of the package and circuit board.
TCV
OUT
= (V
OUT-HIGH
- V
OUT-LOW
) *10^6/(V
R
*
ΔTemperature),
V
OUT-HIGH
= highest voltage measured over the temperature
range. V
OUT-LOW
= lowest voltage measured over the temperature range.
©
2010 Microchip Technology Inc.
DS22075B-page 5
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