FDC72C66 datasheet, PDF - EEWORLD Datasheet

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FDC72C66: DescriptionSecondary Storage Controller, CMOS, CDIP40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，24 Pages; ManufacturerSMSC; Websitehttp://www.smsc.com/

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FDC72C66 Overview

Secondary Storage Controller, CMOS, CDIP40

FDC72C66 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SMSC
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	12 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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FDC72C66 Related Products

	FDC72C66	FDC72C65CD	FDC72C65LJP	FDC72C65P	FDC72C66CD	FDC72C66P	FDC72C66LJP
Description	Secondary Storage Controller, CMOS, CDIP40	Secondary Storage Controller, CMOS, CDIP40	Secondary Storage Controller, CMOS, PQCC44	Secondary Storage Controller, CMOS, PDIP40	Secondary Storage Controller, CMOS, CDIP40	Secondary Storage Controller, CMOS, PDIP40	Secondary Storage Controller, CMOS, PQCC44
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SMSC	SMSC	SMSC	SMSC	SMSC	SMSC	SMSC
package instruction	DIP, DIP40,.6	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ	DIP, DIP40,.6	DIP, DIP40,.6	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T40	R-XDIP-T40	S-PQCC-J44	R-PDIP-T40	R-XDIP-T40	R-PDIP-T40	S-PQCC-J44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	40	40	44	40	40	40	44
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-10 °C	-10 °C	-10 °C	-10 °C	-10 °C	-10 °C	-10 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	QCCJ	DIP	DIP	DIP	QCCJ
Encapsulate equivalent code	DIP40,.6	DIP40,.6	LDCC44,.7SQ	DIP40,.6	DIP40,.6	DIP40,.6	LDCC44,.7SQ
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	12 mA	12 mA	12 mA	12 mA	12 mA	12 mA	12 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	QUAD

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