Secondary Storage Controller, CMOS, PQCC44
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SMSC |
| package instruction | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PQCC-J44 |
| JESD-609 code | e0 |
| Number of terminals | 44 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -10 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC44,.7SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 12 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| FDC72C66LJP | FDC72C65CD | FDC72C65LJP | FDC72C65P | FDC72C66 | FDC72C66CD | FDC72C66P | |
|---|---|---|---|---|---|---|---|
| Description | Secondary Storage Controller, CMOS, PQCC44 | Secondary Storage Controller, CMOS, CDIP40 | Secondary Storage Controller, CMOS, PQCC44 | Secondary Storage Controller, CMOS, PDIP40 | Secondary Storage Controller, CMOS, CDIP40 | Secondary Storage Controller, CMOS, CDIP40 | Secondary Storage Controller, CMOS, PDIP40 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | SMSC | SMSC | SMSC | SMSC | SMSC | SMSC | SMSC |
| package instruction | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-PQCC-J44 | R-XDIP-T40 | S-PQCC-J44 | R-PDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-PDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 44 | 40 | 44 | 40 | 40 | 40 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | QCCJ | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
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