RSFAL thru RSFML
Taiwan Semiconductor
CREAT BY ART
Surface Mount Fast Recovery Rectifiers
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- High temperature metallurgically bonded construction
- Fast switching for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case:
Sub SMA
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.019 g (approximately)
Sub SMA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@ 0.5 A
Maximum reverse current @ rated VR T
J
=25
℃
T
J
=125
℃
Typical junction capacitance (Note 2)
Maximum reverse recovery time (Note 3)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
Cj
Trr
R
θjC
R
θjA
T
J
T
STG
150
32
150
- 55 to +150
- 55 to +150
SYMBOL
RSF
AL
FAL
50
35
50
RSF
BL
FBL
100
70
100
RSF
DL
FDL
200
140
200
RSF
GL
FGL
400
280
400
0.5
10
1.3
5
50
4
250
500
O
RSF
JL
FJL
600
420
600
RSF
KL
FKL
800
560
800
RSF
ML
FML
1000
700
1000
UNIT
V
V
V
A
A
V
μA
pF
ns
C/W
O
O
C
C
Document Number: DS_D1405033
Version: J14
RSFAL thru RSFML
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
AEC-Q101
QUALIFIED
RU
RV
RT
MT
RQ
MQ
R3
RF
R2
M2
RH
MH
Note 1: "x" defines voltage from 50V (RSFAL) to 1000V (RSFML)
PACKING CODE
GREEN COMPOUND
CODE
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
1,800 / 7" Plastic reel (8mm tape)
3,000 / 7" Plastic reel (8mm tape)
7,500 / 13" Paper reel (8mm tape)
7,500 / 13" Plastic reel (8mm tape)
10,000 / 13" Paper reel (8mm tape)
10,000 / 13" Plastic reel (8mm tape)
1,800 / 7" Plastic reel (12mm tape)
3,000 / 7" Plastic reel (12mm tape)
7,500 / 13" Paper reel (12mm tape)
7,500 / 13" Plastic reel (12mm tape)
10,000 / 13" Paper reel (12mm tape)
10,000 / 13" Plastic reel (12mm tape)
PACKAGE
PACKING
RSFxL
(Note 1)
Prefix "H"
Suffix "G"
EXAMPLE
PREFERRED P/N
RSFML RU
RSFML RUG
RSFMLHRU
PART NO.
RSFML
RSFML
RSFML
H
AEC-Q101
QUALIFIED
PACKING CODE
RU
RU
RU
G
Green compound
AEC-Q101 qualified
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
AVERAGE FORWARD CURRENT (A)
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100
125
150
175
LEAD TEMPERATURE (
o
C)
RESISTIVE OR
INDUCTIVE LOAD
INSTANTANEOUS REVERSE CURRENT
(μA)
FIG.1 FORWARD CURRENT DERATING CURVE
10
1
TJ=100℃
0.1
0.01
TJ=25℃
0.001
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT
(A)
PEAK FORWARD SURGE CURRENT
(A)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
10
8.3ms Single Half Sine Wave
8
6
4
2
0
1
10
NUMBER OF CYCLES AT 60 Hz
100
FIG. 5 TYPICAL FORWARD CHARACTERISTICS
10
Pulse Width=300μs
1% Duty Cycle
1
0.1
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
FORWARD VOLTAGE (V)
Document Number: DS_D1405033
Version: J14
RSFAL thru RSFML
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
10
f=1.0MHz
Vsig=50mVp-p
CAPACITANCE (pF)
1
1
10
REVERSE VOLTAGE (V)
100
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
1.70
2.70
0.16
1.23
0.80
3.40
2.45
0.35
0.00
Max
1.90
2.90
0.30
1.43
1.20
3.80
2.60
0.85
0.10
Unit (inch)
Min
0.067
0.106
0.006
0.048
0.031
0.134
0.096
0.014
0.000
Max
0.075
0.114
0.012
0.056
0.047
0.150
0.102
0.033
0.004
DIM.
B
C
D
E
F
G
H
I
J
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
Unit (mm)
1.4
1.2
3.1
1.9
4.3
Unit (inch)
0.055
0.047
0.122
0.075
0.169
MARKING DIAGRAM
P/N
G
YW
F
= Marking Code
= Green Compound
= Date Code
= Factory Code
Document Number: DS_D1405033
Version: J14
RSFAL thru RSFML
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405033
Version: J14
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