Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | PGA |
| package instruction | CAVITY UP, PGA-68 |
| Contacts | 68 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | S-CPGA-P68 |
| JESD-609 code | e0 |
| length | 29.464 mm |
| memory density | 64 bit |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 68 |
| word count | 8 words |
| character code | 8 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 8X8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA68,11X11 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.207 mm |
| Maximum slew rate | 0.07 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 29.464 mm |
| IDT79R3020-25GB | IDT79R3020-16GB | IDT79R302016JB | IDT79R3020-20GB | IDT79R302020JB | IDT79R302025JB | |
|---|---|---|---|---|---|---|
| Description | Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68 | Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68 | Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68 | Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68 | Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68 | Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68 |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | PGA | PGA | LCC | PGA | LCC | LCC |
| package instruction | CAVITY UP, PGA-68 | CAVITY UP, PGA-68 | QCCJ, | CAVITY UP, PGA-68 | QCCJ, | QCCJ, |
| Contacts | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | unknown | unknown |
| JESD-30 code | S-CPGA-P68 | S-CPGA-P68 | S-PQCC-J68 | S-CPGA-P68 | S-PQCC-J68 | S-PQCC-J68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 29.464 mm | 29.464 mm | 24.2062 mm | 29.464 mm | 24.2062 mm | 24.2062 mm |
| memory density | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit |
| Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 |
| word count | 8 words | 8 words | 8 words | 8 words | 8 words | 8 words |
| character code | 8 | 8 | 8 | 8 | 8 | 8 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 8X8 | 8X8 | 8X8 | 8X8 | 8X8 | 8X8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | PGA | PGA | QCCJ | PGA | QCCJ | QCCJ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY | GRID ARRAY | CHIP CARRIER | GRID ARRAY | CHIP CARRIER | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.207 mm | 5.207 mm | 4.57 mm | 5.207 mm | 4.57 mm | 4.57 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
| Terminal form | PIN/PEG | PIN/PEG | J BEND | PIN/PEG | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | QUAD |
| width | 29.464 mm | 29.464 mm | 24.2062 mm | 29.464 mm | 24.2062 mm | 24.2062 mm |
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