Standard SRAM, 256KX1, 20ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi （Renesas ） |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 20 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| length | 29.88 mm |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 24 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX1 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.01 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BICMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| HM6707P-20 | 6048330 | HM6707P-25 | HM6707JP-25 | |
|---|---|---|---|---|
| Description | Standard SRAM, 256KX1, 20ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | PRESSURE SENSORS | Standard SRAM, 256KX1, 25ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 25ns, BICMOS, PDSO24, 0.300 INCH, SOJ-24 |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible |
| Maker | Hitachi （Renesas ） | - | Hitachi （Renesas ） | Hitachi （Renesas ） |
| Parts packaging code | DIP | - | DIP | SOJ |
| package instruction | DIP, DIP24,.3 | - | DIP, DIP24,.3 | SOJ, SOJ24,.34 |
| Contacts | 24 | - | 24 | 24 |
| Reach Compliance Code | unknown | - | unknown | unknown |
| ECCN code | EAR99 | - | EAR99 | EAR99 |
| Maximum access time | 20 ns | - | 25 ns | 25 ns |
| I/O type | SEPARATE | - | SEPARATE | SEPARATE |
| JESD-30 code | R-PDIP-T24 | - | R-PDIP-T24 | R-PDSO-J24 |
| JESD-609 code | e0 | - | e0 | e0 |
| length | 29.88 mm | - | 29.88 mm | 15.63 mm |
| memory density | 262144 bit | - | 262144 bit | 262144 bit |
| Memory IC Type | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | - | 1 | 1 |
| Number of functions | 1 | - | 1 | 1 |
| Number of ports | 1 | - | 1 | 1 |
| Number of terminals | 24 | - | 24 | 24 |
| word count | 262144 words | - | 262144 words | 262144 words |
| character code | 256000 | - | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | - | 70 °C | 70 °C |
| organize | 256KX1 | - | 256KX1 | 256KX1 |
| Output characteristics | 3-STATE | - | 3-STATE | 3-STATE |
| Exportable | NO | - | NO | NO |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | - | DIP | SOJ |
| Encapsulate equivalent code | DIP24,.3 | - | DIP24,.3 | SOJ24,.34 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | - | IN-LINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL |
| power supply | 5 V | - | 5 V | 5 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | - | 5.08 mm | 3.76 mm |
| Maximum standby current | 0.01 A | - | 0.01 A | 0.01 A |
| Minimum standby current | 4.5 V | - | 4.5 V | 4.5 V |
| Maximum slew rate | 0.12 mA | - | 0.12 mA | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V |
| surface mount | NO | - | NO | YES |
| technology | BICMOS | - | BICMOS | BICMOS |
| Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | - | DUAL | DUAL |
| width | 7.62 mm | - | 7.62 mm | 7.62 mm |
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