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DM54LS165J/883C

Description
IC,SHIFT REGISTER,LS-TTL,DIP,16PIN,CERAMIC
Categorylogic    logic   
File Size350KB,6 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

DM54LS165J/883C Overview

IC,SHIFT REGISTER,LS-TTL,DIP,16PIN,CERAMIC

DM54LS165J/883C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
Counting directionRIGHT
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Number of digits8
Number of functions1
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class C
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

DM54LS165J/883C Related Products

DM54LS165J/883C DM54LS165W/883B DM54LS165J/883B DM54LS165W/883C 5962-01-127-4362
Description IC,SHIFT REGISTER,LS-TTL,DIP,16PIN,CERAMIC IC,SHIFT REGISTER,LS-TTL,FP,16PIN,CERAMIC IC,SHIFT REGISTER,LS-TTL,DIP,16PIN,CERAMIC IC,SHIFT REGISTER,LS-TTL,FP,16PIN,CERAMIC IC,SHIFT REGISTER,LS-TTL,DIP,16PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DFP, FL16,.3 DIP, DIP16,.3 DFP, FL16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown compliant
Maker Texas Instruments - Texas Instruments Texas Instruments -
Counting direction RIGHT RIGHT - RIGHT RIGHT
JESD-30 code R-XDIP-T16 R-XDFP-F16 - R-XDFP-F16 R-XDIP-T16
JESD-609 code e0 e0 - e0 -
Number of digits 8 8 - 8 8
Number of functions 1 1 - 1 1
Number of terminals 16 16 - 16 16
Maximum operating temperature 125 °C 125 °C - 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C - -55 °C -55 °C
Package body material CERAMIC CERAMIC - CERAMIC CERAMIC
encapsulated code DIP DFP - DFP DIP
Encapsulate equivalent code DIP16,.3 FL16,.3 - FL16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK - FLATPACK IN-LINE
power supply 5 V 5 V - 5 V 5 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Filter level MIL-STD-883 Class C 38535Q/M;38534H;883B - MIL-STD-883 Class C 38535Q/M;38534H;883B
Nominal supply voltage (Vsup) 5 V 5 V - 5 V 5 V
surface mount NO YES - YES NO
technology TTL TTL - TTL TTL
Temperature level MILITARY MILITARY - MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) -
Terminal form THROUGH-HOLE FLAT - FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm - 1.27 mm 2.54 mm
Terminal location DUAL DUAL - DUAL DUAL
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