IC,SHIFT REGISTER,LS-TTL,FP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| Counting direction | RIGHT |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DM54LS165W/883B | DM54LS165J/883B | DM54LS165J/883C | DM54LS165W/883C | 5962-01-127-4362 | |
|---|---|---|---|---|---|
| Description | IC,SHIFT REGISTER,LS-TTL,FP,16PIN,CERAMIC | IC,SHIFT REGISTER,LS-TTL,DIP,16PIN,CERAMIC | IC,SHIFT REGISTER,LS-TTL,DIP,16PIN,CERAMIC | IC,SHIFT REGISTER,LS-TTL,FP,16PIN,CERAMIC | IC,SHIFT REGISTER,LS-TTL,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant |
| Counting direction | RIGHT | - | RIGHT | RIGHT | RIGHT |
| JESD-30 code | R-XDFP-F16 | - | R-XDIP-T16 | R-XDFP-F16 | R-XDIP-T16 |
| JESD-609 code | e0 | - | e0 | e0 | - |
| Number of digits | 8 | - | 8 | 8 | 8 |
| Number of functions | 1 | - | 1 | 1 | 1 |
| Number of terminals | 16 | - | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | - | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | - | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | - | DIP | DFP | DIP |
| Encapsulate equivalent code | FL16,.3 | - | DIP16,.3 | FL16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | - | IN-LINE | FLATPACK | IN-LINE |
| power supply | 5 V | - | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | - | MIL-STD-883 Class C | MIL-STD-883 Class C | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
| surface mount | YES | - | NO | YES | NO |
| technology | TTL | - | TTL | TTL | TTL |
| Temperature level | MILITARY | - | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | FLAT | - | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | - | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | - | DUAL | DUAL | DUAL |
| Maker | - | Texas Instruments | Texas Instruments | Texas Instruments | - |
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