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U1010-QH_10

Description
SPECIALTY TELECOM CIRCUIT, QCC24
CategoryTopical application    Wireless rf/communication   
File Size757KB,5 Pages
ManufacturerMimix Broadband (MACOM)
Websitehttp://www.macom.com
Download Datasheet Parametric Compare View All

U1010-QH_10 Overview

SPECIALTY TELECOM CIRCUIT, QCC24

U1010-QH_10 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals24
Maximum operating temperature85 Cel
Minimum operating temperature-55 Cel
Rated supply voltage4 V
Processing package description4 X 4 MM, ROHS COMPLIANT, QFN-24
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeSQUARE
Package SizeCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mountYes
Terminal formNO LEAD
Terminal spacing0.5000 mm
terminal coatingMATTE TIN OVER COPPER
Terminal locationQUAD
Packaging MaterialsUNSPECIFIED
Temperature levelOTHER
Communication typeTELECOM CIRCUIT
17.0-34.0 GHz Up-Converter
QFN, 4x4mm
February 2010 - Rev 12-Feb-10
U1010-QH
Features
Integrated Balanced Mixer, LO Buffer and LO Doubler
+23.0 dBm Input Third Order Intercept (IIP3)
+2.0 dBm LO Drive Level
4x4mm QFN Package
100% RF and DC Testing
General Description
Mimix Broadband’s 17.0-34.0 GHz GaAs packaged
up-converter has an input third order intercept point
of +23.0 dBm and 10.0 dB of conversion loss. The
device consists of a balanced resistive pHEMT mixer,
LO buffer amplifier and LO doubler packaged in an
industry standard, fully molded 4x4mm QFN package.
IF and *IF mixer inputs are provided and an external
180 degree hybrid is required. The device includes
on-chip ESD protection structures and DC by-pass
capacitors to ease the implementation and volume
assembly of the packaged part. This device is well
suited for Millimeter-wave Point-to-Point Radio, LMDS,
SATCOM and VSAT applications.
Absolute Maximum Ratings
1
Drain Voltage Supply (Vdd)
Drain Current (Ids)
Input Power (Pin) IF
Input Power (Pin) LO
Storage Temperature (Tstg)
Operating Temperature (Tb)
ESD Min. - Machine Model (MM)
ESD Min. - Human Body Model (HBM)
MSL Level
+4.3V
350 mA
+5 dBm
+10 dBm
-65 to +165 ºC
-55 to +85 ºC
Class A
Class 0
MSL3
Electrical Characteristics (Ambient Temperature T = 25
o
C)
Parameter
Frequency Range (RF)
Frequency Range (LO)
Frequency Range (IF)
Conversion Loss (CL)
Input Third Order Intercept (IIP3)
LO Input Drive
RF Input Return Loss
LO Input Return Loss
IF Input Return Loss
2xLO Leakage at RF
1xLO Leakage at RF
Drain Bias Voltage (Vd1,2)
Gate Bias Voltage (Vg1)
Gate Bias Voltage (Vg2,3)
Gate Bias Voltage (Vss)
Supply Current (Id1)
Supply Current (Id2)
Supply Current (Iss)
Units
GHz
GHz
GHz
dB
dBm
dBm
dB
dB
dB
dBm
dBm
VDC
VDC
VDC
VDC
mA
mA
mA
Min.
17
8
DC
Typ.
Max.
34
20
3.5
10
23
2
15
15
15
-20
-30
4.0
~ -0.2
-0.8
-4.0
130
~ 60
45
Page 1 of 5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
©2010
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.

U1010-QH_10 Related Products

U1010-QH_10 U1010-QH XU1010-QH-0G00 XU1010-QH-EV1 XU1010-QH-0G0T
Description SPECIALTY TELECOM CIRCUIT, QCC24 SPECIALTY TELECOM CIRCUIT, QCC24 SPECIALTY TELECOM CIRCUIT, QCC24 SPECIALTY TELECOM CIRCUIT, QCC24 SPECIALTY TELECOM CIRCUIT, QCC24
Number of functions 1 1 1 1 1
Number of terminals 24 24 24 24 24
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
Minimum operating temperature -55 Cel -55 Cel -55 Cel -55 Cel -55 Cel
Rated supply voltage 4 V 4 V 4 V 4 V 4 V
Processing package description 4 X 4 MM, ROHS COMPLIANT, QFN-24 4 X 4 MM, ROHS COMPLIANT, QFN-24 4 X 4 MM, ROHS COMPLIANT, QFN-24 4 X 4 MM, ROHS COMPLIANT, QFN-24 4 X 4 MM, ROHS COMPLIANT, QFN-24
Lead-free Yes Yes Yes Yes Yes
EU RoHS regulations Yes Yes Yes Yes Yes
state ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
packaging shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package Size CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mount Yes Yes Yes Yes Yes
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal spacing 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm
terminal coating MATTE TIN OVER COPPER MATTE TIN OVER COPPER MATTE TIN OVER COPPER MATTE TIN OVER COPPER MATTE TIN OVER COPPER
Terminal location QUAD QUAD QUAD QUAD QUAD
Packaging Materials UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Temperature level OTHER OTHER OTHER OTHER OTHER
Communication type TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
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