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HMT325S6BFR8C-H9

Description
204pin DDR3 SDRAM SODIMM
Categorystorage    storage   
File Size551KB,54 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Environmental Compliance
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HMT325S6BFR8C-H9 Overview

204pin DDR3 SDRAM SODIMM

HMT325S6BFR8C-H9 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSK Hynix
Parts packaging codeDMA
package instructionDIMM, DIMM204,24
Contacts204
Reach Compliance Codeunknow
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Maximum access time20 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)667 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N204
JESD-609 codee1
length67.6 mm
memory density17179869184 bi
Memory IC TypeDDR DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals204
word count268435456 words
character code256000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature
organize256MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM204,24
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)260
power supply1.5 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height3.8 mm
self refreshYES
Maximum standby current0.096 A
Maximum slew rate1.24 mA
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formNO LEAD
Terminal pitch0.6 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width30 mm
204pin DDR3 SDRAM SODIMM
DDR3 SDRAM
Unbuffered SODIMMs
Based on 2Gb B-die
HMT312S6BFR6C
HMT325S6BFR6C
HMT325S6BFR8C
HMT351S6BFR8C
*Hynix Semiconductor reserves the right to change products or specifications without notice.
Rev. 0.2 / Feb. 2010
1

HMT325S6BFR8C-H9 Related Products

HMT325S6BFR8C-H9 HMT312S6BFR6C-H9 HMT312S6BFR6C-G7 HMT312S6BFR6C-PB HMT325S6BFR6C-G7 HMT325S6BFR8C-G7 HMT325S6BFR6C-H9 HMT351S6BFR8C-G7 HMT351S6BFR8C-PB HMT351S6BFR8C-H9
Description 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM 204pin DDR3 SDRAM SODIMM
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to conform to
Maker SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
Parts packaging code DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA
package instruction DIMM, DIMM204,24 DIMM, DIMM204,24 DIMM, DIMM204,24 DIMM, DIMM204,24 DIMM, DIMM204,24 DIMM, DIMM204,24 DIMM, DIMM204,24 DIMM, DIMM204,24 DIMM, DIMM204,24 DIMM, DIMM204,24
Contacts 204 204 204 204 204 204 204 204 204 204
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow unknow unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode DUAL BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 667 MHz 667 MHz 533 MHz 800 MHz 533 MHz 533 MHz 667 MHz 533 MHz 800 MHz 667 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XDMA-N204 R-XDMA-N204 R-XDMA-N204 R-XDMA-N204 R-XDMA-N204 R-XDMA-N204 R-XDMA-N204 R-XDMA-N204 R-XDMA-N204 R-XDMA-N204
JESD-609 code e1 e1 e1 e1 e1 e1 e1 e1 e1 e1
length 67.6 mm 67.6 mm 67.6 mm 67.6 mm 67.6 mm 67.6 mm 67.6 mm 67.6 mm 67.6 mm 67.6 mm
memory density 17179869184 bi 8589934592 bi 8589934592 bi 8589934592 bi 17179869184 bi 17179869184 bi 17179869184 bi 34359738368 bi 34359738368 bi 34359738368 bi
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
memory width 64 64 64 64 64 64 64 64 64 64
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1 1
Number of terminals 204 204 204 204 204 204 204 204 204 204
word count 268435456 words 134217728 words 134217728 words 134217728 words 268435456 words 268435456 words 268435456 words 536870912 words 536870912 words 536870912 words
character code 256000000 128000000 128000000 128000000 256000000 256000000 256000000 512000000 512000000 512000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
organize 256MX64 128MX64 128MX64 128MX64 256MX64 256MX64 256MX64 512MX64 512MX64 512MX64
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
Encapsulate equivalent code DIMM204,24 DIMM204,24 DIMM204,24 DIMM204,24 DIMM204,24 DIMM204,24 DIMM204,24 DIMM204,24 DIMM204,24 DIMM204,24
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260 260 260
power supply 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 8192 8192 8192 8192 8192 8192 8192 8192 8192 8192
Maximum seat height 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm
self refresh YES YES YES YES YES YES YES YES YES YES
Maximum standby current 0.096 A 0.12 A 0.1 A 0.12 A 0.096 A 0.096 A 0.096 A 0.192 A 0.192 A 0.192 A
Maximum slew rate 1.24 mA 0.68 mA 0.52 mA 0.72 mA 0.7 mA 1.2 mA 0.8 mA 1.4 mA 1.6 mA 1.48 mA
Maximum supply voltage (Vsup) 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V
Minimum supply voltage (Vsup) 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V
Nominal supply voltage (Vsup) 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 20 20 20 20 20 20 20 20 20 20
width 30 mm 30 mm 30 mm 30 mm 30 mm 30 mm 30 mm 30 mm 30 mm 30 mm
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