HMT351S6BFR8C-H9 datasheet, PDF

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HMT351S6BFR8C-H9: Description204pin DDR3 SDRAM SODIMM; Categorystorage storage; File Size551KB，54 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/; Environmental Compliance

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HMT351S6BFR8C-H9 Overview

204pin DDR3 SDRAM SODIMM

HMT351S6BFR8C-H9 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SK Hynix
Parts packaging code	DMA
package instruction	DIMM, DIMM204,24
Contacts	204
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	20 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	667 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N204
JESD-609 code	e1
length	67.6 mm
memory density	34359738368 bi
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	204
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	512MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM204,24
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260
power supply	1.5 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	3.8 mm
self refresh	YES
Maximum standby current	0.192 A
Maximum slew rate	1.48 mA
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	NO LEAD
Terminal pitch	0.6 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	20
width	30 mm

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204pin DDR3 SDRAM SODIMM

DDR3 SDRAM

Unbuffered SODIMMs

Based on 2Gb B-die

HMT312S6BFR6C

HMT325S6BFR6C

HMT325S6BFR8C

HMT351S6BFR8C

*Hynix Semiconductor reserves the right to change products or specifications without notice.

Rev. 0.2 / Feb. 2010

HMT351S6BFR8C-H9 Related Products

	HMT351S6BFR8C-H9	HMT312S6BFR6C-H9	HMT312S6BFR6C-G7	HMT312S6BFR6C-PB	HMT325S6BFR6C-G7	HMT325S6BFR8C-G7	HMT325S6BFR6C-H9	HMT325S6BFR8C-H9	HMT351S6BFR8C-G7	HMT351S6BFR8C-PB
Description	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM	204pin DDR3 SDRAM SODIMM
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	DMA	DMA	DMA	DMA	DMA	DMA	DMA	DMA	DMA	DMA
package instruction	DIMM, DIMM204,24	DIMM, DIMM204,24	DIMM, DIMM204,24	DIMM, DIMM204,24	DIMM, DIMM204,24	DIMM, DIMM204,24	DIMM, DIMM204,24	DIMM, DIMM204,24	DIMM, DIMM204,24	DIMM, DIMM204,24
Contacts	204	204	204	204	204	204	204	204	204	204
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns	20 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	667 MHz	667 MHz	533 MHz	800 MHz	533 MHz	533 MHz	667 MHz	667 MHz	533 MHz	800 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204
JESD-609 code	e1	e1	e1	e1	e1	e1	e1	e1	e1	e1
length	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm
memory density	34359738368 bi	8589934592 bi	8589934592 bi	8589934592 bi	17179869184 bi	17179869184 bi	17179869184 bi	17179869184 bi	34359738368 bi	34359738368 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	64	64	64	64	64	64	64	64	64
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	204	204	204	204	204	204	204	204	204	204
word count	536870912 words	134217728 words	134217728 words	134217728 words	268435456 words	268435456 words	268435456 words	268435456 words	536870912 words	536870912 words
character code	512000000	128000000	128000000	128000000	256000000	256000000	256000000	256000000	512000000	512000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
organize	512MX64	128MX64	128MX64	128MX64	256MX64	256MX64	256MX64	256MX64	512MX64	512MX64
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM204,24	DIMM204,24	DIMM204,24	DIMM204,24	DIMM204,24	DIMM204,24	DIMM204,24	DIMM204,24	DIMM204,24	DIMM204,24
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260	260	260
power supply	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192	8192	8192	8192	8192	8192	8192	8192
Maximum seat height	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm
self refresh	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum standby current	0.192 A	0.12 A	0.1 A	0.12 A	0.096 A	0.096 A	0.096 A	0.096 A	0.192 A	0.192 A
Maximum slew rate	1.48 mA	0.68 mA	0.52 mA	0.72 mA	0.7 mA	1.2 mA	0.8 mA	1.24 mA	1.4 mA	1.6 mA
Maximum supply voltage (Vsup)	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V
Minimum supply voltage (Vsup)	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V
Nominal supply voltage (Vsup)	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm	0.6 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	20	20	20	20	20	20	20	20	20	20
width	30 mm	30 mm	30 mm	30 mm	30 mm	30 mm	30 mm	30 mm	30 mm	30 mm

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