EEWORLDEEWORLDEEWORLD

Part Number

Search

B3DA

Description
Ultra-low Profile Dome Array
File Size426KB,6 Pages
ManufacturerOMRON
Websitehttps://www.omron.com
Download Datasheet View All

B3DA Overview

Ultra-low Profile Dome Array

Ultra-low Profile Dome Array
B3DA
Ultra-low Profile Dome Array With Dust-Proof
Construction and Crisp Clicking Action
• No soldering required. Attach directly to PCB to make an ultra-low
profile tactile switch.
• Matrix adhesive used to create highly dust-proof construction
with good ventilation. Omron's unique circular contact action
ensures a high level of resistance to foreign matter.
• Lower profile, lighter weight, and crisp clicking action.
• Customization of Dome Array available upon request
(i.e., silver plating, number of contacts, shape, etc.).
• RoHS Compliant.
Ordering Information
Item
4 mm dome array
5 mm dome array
Note:
Representative versions for engineering evaluation.
Model (see note)
B3DA-0010-A
B3DA-0000-A
Specifications
Item
Model
B3DA-0010-A
B3DA-0000-A
and custom 4 mm dia. versions
and custom 5 mm dia. versions
4-mm dia.
5-mm dia.
approx. 160
±
50 gf (1.57± 0.49 N)
20 gf min. (0.2 N min.)
0.2
±
0.1 mm
0.25
±
0.1 mm
500,000 operations min.
1,000,000 operations min.
10 mA at 12 VDC (resistive)
1 mA at 3 VDC (resistive)
-40 to 80°C (at 60% RH max.) with no icing or condensation.
10% to 90% (at 40°C max.)
Stainless steel
Unplated. (Silver plating available for custom models.)
Diameter of contact dome
Operating force (OF)
Releasing force (RF)
Pretravel (PT)
Height
Life expectancy
Switching capacity
Minimum permissible load
Ambient operating temperature
Ambient storage humidity
Contact - base material
Plating
Note:
Contact dome specifications not shown in this table are also available. Consult Omron for customization requirements.
Recommended Contact Form on PCB
4-mm Diameter Contact Dome
Single-side PCB
5.2 dia.
1.8 dia.
Gold-plated nickel
0.4
1.2 2.0
5-mm Diameter Contact Dome
Single-side PCB
6.2 dia.
2.3 dia.
Gold-plated nickel
0.4
1.2 2.0
Multilayer PCB
5.2 dia.
1.8 dia.
Gold-plated
nickel
Multilayer PCB
6.2 dia.
2.3 dia.
Gold-plated
nickel
2.8 dia.
Resist (30 to 50 µm)
2.8 dia.
3.8 dia.
Resist (30 to 50 µm)
3.8 dia.
Ultra-low Profile Dome Array
B3DA
273

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2613  841  1079  1805  359  53  17  22  37  8 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号