MEMORY MODULE,DRAM,FAST PAGE,2MX72,CMOS,SSIM,100PIN,PLASTIC
| Parameter Name | Attribute value |
| Maker | NXP |
| package instruction | SIMM, SSIM100 |
| Reach Compliance Code | unknown |
| Maximum access time | 70 ns |
| I/O type | COMMON |
| JESD-30 code | R-PSMA-N100 |
| memory density | 150994944 bit |
| Memory IC Type | FAST PAGE DRAM MODULE |
| memory width | 72 |
| Number of terminals | 100 |
| word count | 2097152 words |
| character code | 2000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX72 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SIMM |
| Encapsulate equivalent code | SSIM100 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 1024 |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | SINGLE |
| MCM72200SG70 | MCM72200SG60 | MCM72200SG80 | |
|---|---|---|---|
| Description | MEMORY MODULE,DRAM,FAST PAGE,2MX72,CMOS,SSIM,100PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX72,CMOS,SSIM,100PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,2MX72,CMOS,SSIM,100PIN,PLASTIC |
| Maker | NXP | NXP | NXP |
| package instruction | SIMM, SSIM100 | SIMM, SSIM100 | SIMM, SSIM100 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 70 ns | 60 ns | 80 ns |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | R-PSMA-N100 | R-PSMA-N100 | R-PSMA-N100 |
| memory density | 150994944 bit | 150994944 bit | 150994944 bit |
| Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| memory width | 72 | 72 | 72 |
| Number of terminals | 100 | 100 | 100 |
| word count | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 2MX72 | 2MX72 | 2MX72 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SIMM | SIMM | SIMM |
| Encapsulate equivalent code | SSIM100 | SSIM100 | SSIM100 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 1024 | 1024 | 1024 |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | SINGLE | SINGLE | SINGLE |