Surface Mount PPTC
FSMD2920 Series
FEATURES
•2920 size, Surface mountable,
•Application: All high-density boards
•Operation Current: 300mA ~ 3.0A
•Maximum Voltage: 6V ~ 60V
•Temperature Range: -40°C to 85°C
•RoHS Compliant
RoHS
ü
AGENCY RECOGNITION
•UL (E211981)
•C-UL (E211981)
•TUV (R50090556)
ELECTRICAL CHARACTERISTICS (23°C)
Part Number
FSMD030-2920
FSMD050-2920
FSMD075-2920
FSMD100-2920
FSMD125-2920
FSMD150-2920
FSMD185-2920
FSMD200-2920
FSMD250-2920
FSMD260-2920
Hold
Current
I
H
, A
0.30
0.50
0.75
1.10
1.25
1.50
1.85
2.00
2.50
2.60
Trip
Current
I
T
, A
0.60
1.00
1.50
2.20
2.50
3.00
3.70
4.00
5.00
5.20
Rated
Voltage
V
MAX
, Vdc
60
60
33
33
33
33
33
16
16
6
Maximum
Current
I
MAX
, A
10
10
40
40
40
40
40
40
40
40
Typical
Power
Pd, W
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
Max Time to Trip
Current
Amp
1.5
2.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Time
Sec
3.0
4.0
0.3
0.5
2.0
2.0
2.5
4.5
16.0
20.0
Resistance Tolerance
R
MIN
R1
MAX
OHMS
1.000
0.300
0.180
0.090
0.050
0.050
0.040
0.035
0.025
0.020
OHMS
4.80
1.40
1.00
0.41
0.25
0.23
0.15
0.12
0.085
0.075
I
H
=Hold current-maximum current at which the device will not trip at 23°C still air.
I
T
=Trip current-maximum current at which the device will always trip at 23°C still air.
V
MAX
=Maximum voltage device can withstand without damage at its rated current (I
MAX
).
I
MAX
=Maximum fault current device can withstand without damge at rated voltage (V
MAX
).
Pd=Typical power dissipated-type amount of power disipated by the device when in the tripped state in 23°C still air environment.
R
MIN
=Minimum device resistance at 23°C prior to tripping.
R1
MAX
=Maximum device resistance at 23°C measured 1 hour post trip.
Termination pad characteristics
Termination pad materials: Tin-plated copper
FSMD2920 PRODUCT DIMENSIONS (MILLIMETERS)
Part
Number
FSMD030-2920
FSMD050-2920
FSMD075-2920
FSMD100-2920
FSMD125-2920
FSMD150-2920
FSMD185-2920
FSMD200-2920
FSMD250-2920
FSMD260-2920
Min
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
A
Max
Min
B
Max
Min
C
Max
D
Min
0.35
0.35
0.35
0.35
0.35
0.35
0.35
0.35
0.35
0.35
Side view
C
A
Top and bottom view
B
D
7.98 4.80 5.44 0.60 1.15
7.98 4.80 5.44 0.60 1.15
7.98 4.80 5.44 0.35 1.15
7.98 4.80 5.44 0.40 1.00
7.98 4.80 5.44 0.40 0.90
7.98 4.80 5.44 0.40 0.90
7.98 4.80 5.44 0.30 0.90
7.98 4.80 5.44 0.30 0.90
7.98 4.80 5.44 0.30 0.90
7.98 4.80 5.44 0.30 0.90
RFE International
• Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
C5ED04
REV 2007.8.14
Surface Mount PPTC
FSMD2920 Series
THERMAL DERATING CURVE
Thermal Derating Curve, FSMD Series
Percent of Rated Hold and Trip
Current
200%
150%
100%
50%
RoHS
ü
A
B
A= FSMD125 ~ FSMD260
B= FSMD030 ~ FSMD100
0%
-40
-20
0
20
40
60
80
Ambient Temperature (C)
TYPICAL TIME-TO-TRIP AT 23°C
A
100
10
Time-to-trip (S)
B C
D EFGHI
A = FSMD030-2920
B = FSMD050-2920
C = FSMD075-2920
D = FSMD100-2920
E = FSMD125-2920
F = FSMD150-2920
G = FSMD185-2920
H = FSMD200-2920
I = FSMD250-2920
J = FSMD260-2920
1
0.1
0.01
0.001
0.1
1
Fault current (A)
10
100
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimension in the table below provide the recommended pad layout for each FSMD2920 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
Solder Reflow
20 to 40 Seconds
260 °C
Ramp-up
3°C/Second Max
5.6
217 °C
f
Ramp-down
6°C/Second Max
200 °C
150 °C
Preheat
25 °C
60 to 180 Seconds
60 to 150 Seconds
2.3
5.1
2.3
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
NOTE: All Specification subject to change without notice.
RFE International
• Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
C5ED04
REV 2007.8.14
Microcontroller MCU
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