NM27P210QM150 datasheet, PDF - EEWORLD Datasheet

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NM27P210QM150: Description64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40; Categorystorage storage; File Size285KB，9 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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NM27P210QM150 Overview

64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40

NM27P210QM150 Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	WDIP,
Contacts	40
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
JESD-30 code	R-GDIP-T40
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	16
Number of functions	1
Number of terminals	40
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX16
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.72 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

NM27P210QM150 Related Products

	NM27P210QM150	NM27P210Q150	NM27P210QE120	NM27P210VE150	NM27P210VE120	NM27P210QE150	NM27P210V150	NM27P210Q120	NM27P210V120
Description	64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40	64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40	64KX16 UVPROM, 120ns, CDIP40, WINDOWED, CERAMIC, DIP-40	64KX16 OTPROM, 150ns, PQCC44, PLASTIC, LCC-44	64KX16 OTPROM, 120ns, PQCC44, PLASTIC, LCC-44	64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40	64KX16 OTPROM, 150ns, PQCC44, PLASTIC, LCC-44	64KX16 UVPROM, 120ns, CDIP40, WINDOWED, CERAMIC, DIP-40	64KX16 OTPROM, 120ns, PQCC44, PLASTIC, LCC-44
Parts packaging code	DIP	DIP	DIP	LCC	LCC	DIP	LCC	DIP	LCC
package instruction	WDIP,	WDIP, DIP40,.6	WDIP, DIP40,.6	QCCJ, LDCC44,.7SQ	QCCJ, LDCC44,.7SQ	WDIP, DIP40,.6	QCCJ, LDCC44,.7SQ	WDIP, DIP40,.6	QCCJ, LDCC44,.7SQ
Contacts	40	40	40	44	44	40	44	40	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	150 ns	120 ns	150 ns	120 ns	150 ns	150 ns	120 ns	120 ns
JESD-30 code	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	S-PQCC-J44	S-PQCC-J44	R-GDIP-T40	S-PQCC-J44	R-GDIP-T40	S-PQCC-J44
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi	1048576 bi
Memory IC Type	UVPROM	UVPROM	UVPROM	OTP ROM	OTP ROM	UVPROM	OTP ROM	UVPROM	OTP ROM
memory width	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	40	40	40	44	44	40	44	40	44
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	85 °C	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	WDIP	WDIP	WDIP	QCCJ	QCCJ	WDIP	QCCJ	WDIP	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE
Package form	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	CHIP CARRIER	CHIP CARRIER	IN-LINE, WINDOW	CHIP CARRIER	IN-LINE, WINDOW	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.72 mm	5.72 mm	5.72 mm	4.57 mm	4.57 mm	5.72 mm	4.57 mm	5.72 mm	4.57 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	QUAD	DUAL	QUAD
width	15.24 mm	15.24 mm	15.24 mm	16.5862 mm	16.5862 mm	15.24 mm	16.5862 mm	15.24 mm	16.5862 mm
Maker	Texas Instruments	-	-	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-609 code	-	e0	e0	e0	e0	e0	e0	e0	e0
Encapsulate equivalent code	-	DIP40,.6	DIP40,.6	LDCC44,.7SQ	LDCC44,.7SQ	DIP40,.6	LDCC44,.7SQ	DIP40,.6	LDCC44,.7SQ
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Maximum standby current	-	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	-	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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