64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | WDIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 150 ns |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T40 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | UVPROM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 40 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 64KX16 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.72 mm |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| NM27P210QE150 | NM27P210Q150 | NM27P210QE120 | NM27P210VE150 | NM27P210QM150 | NM27P210VE120 | NM27P210V150 | NM27P210Q120 | NM27P210V120 | |
|---|---|---|---|---|---|---|---|---|---|
| Description | 64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 UVPROM, 120ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 OTPROM, 150ns, PQCC44, PLASTIC, LCC-44 | 64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 OTPROM, 120ns, PQCC44, PLASTIC, LCC-44 | 64KX16 OTPROM, 150ns, PQCC44, PLASTIC, LCC-44 | 64KX16 UVPROM, 120ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 OTPROM, 120ns, PQCC44, PLASTIC, LCC-44 |
| Parts packaging code | DIP | DIP | DIP | LCC | DIP | LCC | LCC | DIP | LCC |
| package instruction | WDIP, DIP40,.6 | WDIP, DIP40,.6 | WDIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | WDIP, | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | WDIP, DIP40,.6 | QCCJ, LDCC44,.7SQ |
| Contacts | 40 | 40 | 40 | 44 | 40 | 44 | 44 | 40 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 150 ns | 150 ns | 120 ns | 150 ns | 150 ns | 120 ns | 150 ns | 120 ns | 120 ns |
| JESD-30 code | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | S-PQCC-J44 | R-GDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | R-GDIP-T40 | S-PQCC-J44 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi |
| Memory IC Type | UVPROM | UVPROM | UVPROM | OTP ROM | UVPROM | OTP ROM | OTP ROM | UVPROM | OTP ROM |
| memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 40 | 40 | 40 | 44 | 40 | 44 | 44 | 40 | 44 |
| word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 125 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | -40 °C | -55 °C | -40 °C | - | - | - |
| organize | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | WDIP | WDIP | WDIP | QCCJ | WDIP | QCCJ | QCCJ | WDIP | QCCJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.72 mm | 5.72 mm | 5.72 mm | 4.57 mm | 5.72 mm | 4.57 mm | 4.57 mm | 5.72 mm | 4.57 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | YES | NO | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 16.5862 mm | 15.24 mm | 16.5862 mm | 16.5862 mm | 15.24 mm | 16.5862 mm |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | - | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| I/O type | COMMON | COMMON | COMMON | COMMON | - | COMMON | COMMON | COMMON | COMMON |
| JESD-609 code | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | - | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | - | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
京公网安备 11010802033920号
EEWORLD
