MD32256FKXI-15/AD7 datasheet, PDF

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MD32256FKXI-15/AD7: DescriptionDRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48; Categorystorage storage; File Size395KB，8 Pages; ManufacturerMOSAIC; Websitehttp://www.mosaicsemi.com/

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MD32256FKXI-15/AD7 Overview

DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48

MD32256FKXI-15/AD7 Parametric

Parameter Name	Attribute value
Maker	MOSAIC
Parts packaging code	DIP
package instruction	,
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS
JESD-30 code	R-PDIP-T48
memory density	8388608 bit
Memory IC Type	DRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
refresh cycle	512
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal location	DUAL

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MD32256FKXI-15/AD7 Related Products

	MD32256FKXI-15/AD7	MD32256FKXI-10/AD4	MD32256FKXI-15/AD5	MD32256FKX-15/AD7	MD32256FKX-15/AD5	MD32256FKX-10/AD7	MD32256FKXI-10/AD7	MD32256FKXI-15/AD4
Description	DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48	DRAM Module, 256KX32, 100ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48	DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48	DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48	DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48	DRAM Module, 256KX32, 100ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48	DRAM Module, 256KX32, 100ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48	DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Contacts	48	48	48	48	48	48	48	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	100 ns	150 ns	150 ns	150 ns	100 ns	100 ns	150 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS	RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS
JESD-30 code	R-PDIP-T48	R-PDIP-T48	R-PDIP-T48	R-PDIP-T48	R-PDIP-T48	R-PDIP-T48	R-PDIP-T48	R-PDIP-T48
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE
memory width	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	48	48	48	48	48	48	48	48
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-	-	-40 °C	-40 °C
organize	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32	256KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	512	512	512	512	512	512	512	512
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	MOSAIC	MOSAIC	MOSAIC	-	MOSAIC	MOSAIC	MOSAIC	MOSAIC

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