EEWORLDEEWORLDEEWORLD

Part Number

Search

82S185/BVA

Description
OTP ROM, 2KX4, 115ns, TTL, CDIP18,
Categorystorage    storage   
File Size51KB,3 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

82S185/BVA Overview

OTP ROM, 2KX4, 115ns, TTL, CDIP18,

82S185/BVA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP18,.3
Reach Compliance Codeunknown
Maximum access time115 ns
JESD-30 codeR-XDIP-T18
JESD-609 codee0
memory density8192 bit
Memory IC TypeOTP ROM
memory width4
Number of terminals18
word count2048 words
character code2000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX4
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum slew rate0.13 mA
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Philips Semiconductors Military Bipolar Memory Products
Product specification
8K-bit TTL bipolar PROM (2024x4)
82S185/185A/185B
FEATURES
Address access time: 55ns max
Input loading: -150µA max
On-chip address decoding
No separate fusing pins
Unprogrammed outputs are Low level
Fully TTL compatible
One chip enable input
Outputs: 3-State
APPLICATIONS
DESCRIPTION
The 82S185 is field-programmable, which means that custom
patterns are immediately available by following the Philips Generic I
fusing procedure. The standard 82S185 is supplied with all outputs
at logical Low. Outputs are programmed to a logic High level at any
specified address by fusing the Ni-Cr link matrix.
This device includes on-chip decoding and one chip enable input for
memory expansion. It features 3-State outputs for optimization of
word expansion in bused organizations.
ORDERING INFORMATION
DESCRIPTION
18-pin Ceramic DIP
(300mil-wide)
ORDER CODE
82S185/BVA
82S185A/BVA
82S185B/BVA
82S185/BYA
82S185A/BYA
82S185B/BYA
PACKAGE
DESIGNATOR*
GDIP1-T18
Sequential controllers
Control store
Random logic
Code conversion
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
V
I
V
O
T
A
T
STG
Supply voltage
Input voltage
Output voltage Off-State
Operating temperature range
Storage temperature range
PARAMETER
18-pin Ceramic Flat Pack
GDFP2-F18
* MIL-STD 1835 or Appendix A of 1995 Military Data Handbook
RATING
+7
+5.5
+5.5
-55 to +125
-65 to +150
UNIT
V
DC
V
DC
V
DC
°
C
°
C
PIN CONFIGURATION
BLOCK DIAGRAM
A
5
ADDRESS
LINES
1:64
DECODER
64 x 128 MATRIX
A
6
A
5
A
4
A
3
A
0
A
1
A
2
A
10
GND
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
V
CC
A
7
A
8
A
9
O
1
O
2
O
3
O
4
CE
A
10
A
0
A
4
1:32
MUX
1:32
MUX
1:32
MUX
1:32
MUX
CE
4 3-STATE DRIVERS
O
1
O
2
O
3
O
4
OUTPUT LINES
May 30, 1990
1
853-0265 99704

82S185/BVA Related Products

82S185/BVA 82S185/BYA 82S185A/BYA 82S185A/BVA
Description OTP ROM, 2KX4, 115ns, TTL, CDIP18, OTP ROM, 2KX4, 115ns, TTL, CDFP18, OTP ROM, 2KX4, 55ns, TTL, CDFP18, OTP ROM, 2KX4, 55ns, TTL, CDIP18,
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction DIP, DIP18,.3 DFP, FL18,.3 DFP, FL18,.3 DIP, DIP18,.3
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 115 ns 115 ns 55 ns 55 ns
JESD-30 code R-XDIP-T18 R-XDFP-F18 R-XDFP-F18 R-XDIP-T18
JESD-609 code e0 e0 e0 e0
memory density 8192 bit 8192 bit 8192 bit 8192 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 4 4 4 4
Number of terminals 18 18 18 18
word count 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 2KX4 2KX4 2KX4 2KX4
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DFP DFP DIP
Encapsulate equivalent code DIP18,.3 FL18,.3 FL18,.3 DIP18,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK FLATPACK IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum slew rate 0.13 mA 0.13 mA 0.16 mA 0.16 mA
surface mount NO YES YES NO
technology TTL TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1738  1760  564  1430  2722  35  36  12  29  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号