PRELIMINARY DATA SHEET
MOS INTEGRATED CIRCUIT
MC-2311100
MCP (MULTI-CHIP PACKAGE) MOBILE SPECIFIED RAM AND SRAM
16M-BIT CMOS MOBILE SPECIFIED RAM AND 4M-BIT CMOS SRAM
Description
The MC-2311100 is a stacked type MCP (Multi-Chip Package) of 16,777,216 bits (1,048,576 words by 16 bits) Mobile
specified RAM and 4,194,304 bits (BYTE mode : 524,288 words by 8 bits, WORD mode : 262,144 words by 16 bits)
SRAM.
The MC-2311100 is packaged in a 61-pin TAPE FBGA.
General Features
•
Supply voltage : V
CC
m / V
CC
s = 2.6 to 3.0 V
•
Wide operating temperature : T
A
=
−20
to +70
°C
•
Output Enable input for easy application
•
Byte data control : /LB (I/O0 to I/O7), /UB (I/O8 to I/O15)
Mobile specified RAM Features
•
Memory organization : 1,048,576 words by 16 bits
•
Fast access time : t
AA
= 80, 90, 100 ns (MAX.)
•
Supply current : At operating : 35 mA (MAX.)
At Standby Mode 1 : 100
µ
A (MAX.) Normal standby (Memory cell data hold valid)
At Standby Mode 2 : 10
µ
A (MAX.) Memory cell data hold invalid
•
Chip Enable inputs : /CEm
•
Standby Mode input : MODE
SRAM Features
•
Memory organization : 524,288 words
×
8 bits (BYTE mode)
262,144 words
×
16 bits (WORD mode)
•
Fast access time : t
AA
= 70 ns (MAX.)
•
Supply current : At operating : 40 mA (MAX.)
At Standby Mode : 7
µ
A (MAX.)
•
Low V
CC
data retention: 1.0 V (MIN.)
•
Two Chip Enable inputs: /CE1s, CE2s
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M15432EJ1V0DS00 (1st edition)
Date Published November 2001 NS CP (K)
Printed in Japan
The mark
5
shows major revised points.
©
2001
MC-2311100
Pin Configuration
/xxx indicates active low signal.
61-pin TAPE FBGA (9
×
7)
Top View
8
7
6
5
4
3
2
1
A B C D E F G H J K
K J H G F E D C B A
Bottom View
Top View
A
8
7
6
5
4
3
2
1
NC
NC
A11
A8
/WE
NC
/LB
A7
B
C
A15
A12
A19
MODE
CE2
/UB
A6
A3
D
NC
A13
A9
NC
NC
A18
A5
A2
A17
A4
A1
I/O1
V
SS
A0
E
V
SS
A14
A10
F
A16
SA
I/O6
G
NC
I/O15
I/O13
I/O4
I/O3
I/O9
/OE
/CE1s
H
V
SS
I/O7
I/O12
V
CC
m
V
CC
s
I/O10
I/O0
/CEm
I/O14
I/O5
CIOs
I/O11
I/O2
I/O8
NC
NC
J
K
NC
Common Pins
A0 - A19
/OE
/WE
/LB, /UB
V
SS
NC
Note
Mobile specified RAM Pins
/CEm
MODE
V
CC
m
: Chip Enable
: Standby mode select
: Supply Voltage
: Address inputs
: Output Enable
: Write Enable
: Byte data select
: Ground
: No Connection
I/O0 - I/O15 : Data inputs / outputs
SRAM Pins
/CE1s
CE2s
SA
CIOs
V
CC
s
: Chip Enable
: Chip Enable
: Address input (A18)
: Selects 8-bit or 16-bit mode
: Supply Voltage
Note
Some signals can be applied because this pin is not internally connected.
Remark
Refer to
5. Package Drawing
for the index mark.
Preliminary Data Sheet M15432EJ1V0DS
3
MC-2311100
CONTENTS
1. Bus Operations ...................................................................................................................................................6
2. Mobile specified RAM .........................................................................................................................................7
2.1
2.2
Initialization.................................................................................................................................................7
Standby Mode .............................................................................................................................................8
2.2.1 Standby Mode State Machine ................................................................................................................8
3. Electrical Specifications.....................................................................................................................................9
4. Timing Charts ....................................................................................................................................................19
5. Package Drawing ..............................................................................................................................................42
6. Recommended Soldering Conditions .............................................................................................................43
Preliminary Data Sheet M15432EJ1V0DS
5
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