BRIGHT VIEW
ELECTRONICS CO.,LTD
SUPER BRIGHTNESS SMD LED
PACKAGE CONFIGURATION
BVS-166RP2
Cathode mark
LED die
0.8
0.6
Cathode line
Soldering terminal
Soldering Pattem
1.6
1.0
1.0
0.8
0.8
0.4
0.3
Resin
P C .board
Polarity
0.4
Soldering terminal
0.8
0.7
0.8
Tolerance ± 0.1
DESCRIPTION
Dice Material : AlGaInP/GaAs Red
Light Color : Red Color
Lens Color : Milky Diffused
ABSOLUTE MAXIMUM RATINGS AT Ta = 25
PARAMETER
Power Dissipation
Continuous Forward Current
Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width )
Reverse Voltage
Derating Linear From 25
Operating Temperature Range
Storage Temperature Range
Infrared Soldering Condition 260
for 5 seconds
Reflow Soldering Condition 230
for 10 seconds
MAX.
55
20
100
5
0.35
30 to
80
40 to
85
UNIT
mW
mA
mA
V
mA/
o
C
o
C
o
C
ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25
SYMBOL
V
F
I
R
p
d
2 1/2
PARAMETER
Forward Voltage
Reverse Current
Peak Emission Wavelength
Dominant Wavelength
Viewing Angle
TEST COND.
I
F
= 20 mA
V
R
= 5V
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
MIN.
TYP.
2
650
639
130
MAX.
2.6
100
UNIT
V
A
nm
nm
Deg
BIN GRADE LIMITS ( I F = 20 mA ) LUMINOUS INTENSITY / mcd
Bin
Min.
Max.
u
22
28
v
28
36
w
36
47
x
y
z
47
60
78
60
78
100
Tolerance ± 15%mcd
*Bright View reserves the rights to alter specifications and remove availability of products at any time without notice.
*Dominant Wavelength, d is according to CIE Chromaticity Diagram base on color of lamps.
* 1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
2003/11/4 – B
BRIGHT VIEW
ELECTRONICS CO.,LTD
SMD APPLICATION ( PB FREE SOLDERING )
1XX series.
Apply to BVS-3XX
Description:
(1) Manual soldering (We do not recommend this method strongly.)
(1.1) To prevent cracking,please bake (65 ,24hrs)before soldering.
(1.2) Temperature at tip of iron: 250 Max.(25W)
(1.3) It's banned to load any stress on the resin during soldering.
(1.4) Soldering time: 3 sec. Max.(one time only)
(2) Reflow Soldering
(2.1) To prevent cracking,please bake (65 ,24hrs)before soldering.
(2.2) When soldering,do not put stress on the LEDs during heating.
(2.3) Never take next process until the component is cooled down to room
temperature after reflow.
(2.4) After soldering,do not warp the circuit board.
(2.5) The recommended reflow soldering profile(measuring on the surface
of the LED resin)is following:
10 SEC. MAX.
245 C MAX.
0.5
217
217
150
1 /SEC. MAX.
50 SEC. MAX.
/SEC MAX.
TEMPERATURE
~75
~25
210 SEC. MIN.
100 SEC. MAX.
TIME
The reflow temperature 240 ~245 is recommended and the soldering temperature
should be not higher than 245 (one time only)
2005 / 10 / 20 - B
BRIGHT VIEW
ELECTRONICS CO.,LTD
CHIP LEDS PACKING
BVS-166/167 Series
2.0
Cathode mark
0.05
4.0
0.10
4.0 0.10
1.5
0.10
0.23 0.05
1.75 0.10
3.5 0.05
1.80 0.10
8.0 0.20
Feeding direction
UNIT : mm
0.75 0.10 - BVS-166
0.60 0.10 - BVS-167
178 1.0
60 0.5
Reel : 4,000PCS
12
0.5
UNIT : mm
Label 2
Label 1
Bright View
PART NO.:
Electronics Co.,Ltd.
Electronics Co.,Ltd.
Bright View
PART NO.:
LOT NO.:
GRADE:
Q'ty
X-
-
pcs
LOT NO.:
GRADE:
Q'ty
pcs
QA
BVS-16XXXX
QA
ELECTROSTATIC SENSITIVE DEVICES
DO NOT OPEN OR HANDLE EXCEPT
AT A STATIC-FREE WORKSTATION
Normal
X: Bin grade
: Wavelength
: Vf
Anti-electrostatic bag
24
39
RE
Y
CARTON
Dimension(cm): 39*24*22
22
ITEM NO.
DEVICE:
Q'TY
N. W.:
G. W.:
PCS.
KGS.
KGS.
Carton : 30 Reels
Total : 120,000PCS
2003 / 11 / 12 - A
DSP and ARM Processors
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