
IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 8-BIT DAC, PQCC20, PLASTIC, MO-047AA, LCC-20, Digital to Analog Converter
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ADI |
| Parts packaging code | LPCC |
| package instruction | PLASTIC, MO-047AA, LCC-20 |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Converter type | D/A CONVERTER |
| Enter bit code | OFFSET BINARY |
| Input format | PARALLEL, WORD |
| JESD-30 code | S-PQCC-J20 |
| JESD-609 code | e3 |
| length | 8.965 mm |
| Maximum linear error (EL) | 1.1719% |
| Humidity sensitivity level | 1 |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC20,.4SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Nominal settling time (tstl) | 1.5 µs |
| Maximum slew rate | 3 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 40 |
| width | 8.965 mm |
| AD7548KPZ | AD7548TQ/883B | AD7548JP | AD7548JNZ | |
|---|---|---|---|---|
| Description | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 8-BIT DAC, PQCC20, PLASTIC, MO-047AA, LCC-20, Digital to Analog Converter | 12-Bit, Multiplying, IOUT DAC, 8-Bit Bus | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 8-BIT DAC, PQCC20, PLASTIC, MO-047AA, LCC-20, Digital to Analog Converter | 12-Bit, Multiplying, IOUT DAC, 8-Bit Bus |
| Is it lead-free? | Lead free | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | conform to | incompatible | incompatible | conform to |
| Maker | ADI | ADI | ADI | ADI |
| Parts packaging code | LPCC | DIP | LPCC | DIP |
| package instruction | PLASTIC, MO-047AA, LCC-20 | DIP-20 | LCC-20 | DIP, DIP20,.3 |
| Contacts | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | not_compliant | compliant |
| ECCN code | EAR99 | 3A001.A.2.C | EAR99 | EAR99 |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | OFFSET BINARY | BINARY | OFFSET BINARY | OFFSET BINARY |
| Input format | PARALLEL, WORD | PARALLEL, 8 BITS | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 code | S-PQCC-J20 | R-GDIP-T20 | S-PQCC-J20 | R-PDIP-T20 |
| JESD-609 code | e3 | e0 | e0 | e3 |
| Maximum linear error (EL) | 1.1719% | 0.012% | 2.3438% | 2.3438% |
| Number of digits | 8 | 12 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | QCCJ | DIP |
| Encapsulate equivalent code | LDCC20,.4SQ | DIP20,.3 | LDCC20,.4SQ | DIP20,.3 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | NOT APPLICABLE | 225 | NOT APPLICABLE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 5.08 mm | 4.57 mm | 5.08 mm |
| Nominal settling time (tstl) | 1.5 µs | 0.8 µs | 1.5 µs | 1.5 µs |
| Maximum slew rate | 3 mA | 3 mA | 3 mA | 3 mA |
| Nominal supply voltage | 5 V | 15 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) |
| Terminal form | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | 40 | NOT APPLICABLE | 30 | NOT APPLICABLE |
| width | 8.965 mm | 7.62 mm | 8.965 mm | 7.62 mm |
| length | 8.965 mm | - | 8.965 mm | 27.035 mm |