Storage Temperature Range .............................-40°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS—VGA MODE
(Figure 7, V
CC
= V
REF
= 4.75V to 5.25V, V
CM
= (3/5)V
REF
, T
A
= 0°C to +70°C, V
GND
= 0V, LOW_PWR = 0, M4_EN = 0, CW_FILTER =
0 or 1, TEST_MODE = 0, PD = 0, CW_VG = 1, CW_M1 = 0, CW_M2 = 0, no RF signals applied, capacitance to GND at each of the
VGA differential outputs is 60pF, differential capacitance across the VGA outputs is 10pF, R
L
= 1kΩ, CW mixer outputs pulled up to
+11V through four separate ±0.1% 115Ω resistors, all CW channels programmed off. Typical values are at V
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Microcontroller MCU
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