SN54LVC07AJ datasheet, PDF - EEWORLD Datasheet

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SN54LVC07AJ: DescriptionLVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, CERAMIC, DIP-14; Categorylogic logic; File Size136KB，9 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN54LVC07AJ Overview

LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, CERAMIC, DIP-14

SN54LVC07AJ Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP,
Contacts	14
Reach Compliance Code	unknown
series	LVC/LCX/Z
JESD-30 code	R-GDIP-T14
length	19.56 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
Number of functions	6
Number of entries	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	OPEN-DRAIN
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
propagation delay (tpd)	3.5 ns
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

SN54LVC07AJ Related Products

	SN54LVC07AJ	SN54LVC07AW	SN54LVC07AFK	SN74LVC07ADGV
Description	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, CERAMIC, DIP-14	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CDFP14, CERAMIC, DFP-14	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14, TVSOP-14
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	DFP	QLCC	SOIC
package instruction	DIP,	DFP,	QCCN,	TSSOP, TSSOP14,.25
Contacts	14	14	20	14
Reach Compliance Code	unknown	unknown	unknown	unknown
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-GDIP-T14	R-GDFP-F14	S-CQCC-N20	R-PDSO-G14
length	19.56 mm	9.21 mm	8.89 mm	4.4 mm
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER
Number of functions	6	6	6	6
Number of entries	1	1	1	1
Number of terminals	14	14	20	14
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	DIP	DFP	QCCN	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	FLATPACK	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	3.5 ns	3.5 ns	3.5 ns	3.5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	2.03 mm	2.03 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal form	THROUGH-HOLE	FLAT	NO LEAD	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	0.4 mm
Terminal location	DUAL	DUAL	QUAD	DUAL
width	7.62 mm	6.29 mm	8.89 mm	3.6 mm

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